Electronics manufacturing materials
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Electronics manufacturing materials
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Device cools packages during lead-free reflow
Cookson Electronics Assembly Materials announces the launch of Alpha Coolcap thermal protection devices, developed to cool components during high temperature lead-free reflow and rework processes.
News from Cookson Electronics, Nov 10, 2005
Next dimension in substrate and wafer bumping
Cookson Electronics and EEJA announce the launch of XB3, the next dimension in substrate and wafer bumping technology that promises to bring vastly increased speed.
News from Cookson Electronics, Nov 10, 2005
Lead-free wave solder alloy with high yield
Since its introduction in early 2004 by Cookson Electronics Assembly Materials, Alpha Vaculoy SACX lead-free wave solder alloy has set a new benchmark for performance.
News from Cookson Electronics, Nov 10, 2005
Speciality materials for handset applications
A wide range of speciality materials for handset applications are described in a glossy, four-colour product brochure.
News from Rogers Corp, Oct 27, 2005
Lipari markets advanced circuit materials
David Lipari has been named the new Marketing Manager of the Rogers Corporation Advanced Circuit Materials Division (ACMD), located in Chandler, Arizona.
News from Rogers Corp, Oct 26, 2005
Key lead-free role for Jensen
Indium Corporation has enhanced its Pb-free programme with the appointment of Tim Jensen as Pb-Free Programme Manager.
News from Indium Corporation of America, Oct 26, 2005
Trial scheme puts lead-free solders to the test
Farnell InOne is offering engineers the chance to "test and try" two-metre lengths of lead-free solder wire - costing as little as 99p - to enable them to trial the different products.
News from Farnell InOne, Oct 24, 2005
Pb-free suite on show in Munich
Indium Corporation will be exhibiting its suite of Pb-free electronics assembly materials for WEEE and RoHS compliance at Productronica in Munich, Germany on from 15th to 18th November 2005.
News from Indium Corporation of America, Oct 24, 2005
Distribution network covers Germanic markets
The Electronics Group of Henkel is preparing to reach out to key regional markets in Germany, Austria and Switzerland with a specialised distribution network for solder wires and fluxes.
News from Henkel Loctite Adhesives, Oct 21, 2005
Evans wins SMTA Founder's Award
Indium Corporation's President, Greg Evans, received the prestigious Founder's Award at the Annual meeting of SMTA International.
News from Indium Corporation of America, Oct 20, 2005
Flux remover and coating join lead-free range
UK manufacturer Electrolube will be attending Productronica this year (Stand A3.171), where it will launch two new products to support lead free manufacture.
News from Electrolube, Oct 18, 2005
French distribution for high-performance films
GE Plastics Specialty Film and Sheet has appointed Saint Chamond-based Micel Industrie as a new distributor of its high-performance Ultem films for electrical and electronic applications.
News from GE Advanced Materials, Oct 17, 2005
Polyester film creates extreme switch panels
Autotex XE hardcoated polyester film is being used by Markit Graphics for the production of membrane switch panels used for the flying bridge controls on a new luxury yacht.
News from Autotype, Oct 17, 2005
Made-to-measure adhesive parts speed assembly
Many electronics contractors have discovered the convenience of using Technibond's specialist converting service, offering bonding parts accurately cut to match their working components.
News from Technibond, Oct 17, 2005
Jig puts feeders to the test
The FeederMaster is a multiplatform feeder test jig that can be adapted to test a large range of manufacturers' feeders including Fuji, Phillip, Sanyo and now Siemens.
News from Alternative SMT, Oct 13, 2005
Boron nitride fillers aid thermal management
A major challenge facing electronics manufacturers in moving to smaller and faster devices is effective heat dissipation from semiconductors.
News from GE Advanced Materials, Oct 12, 2005
Chinese subsidiary expands into new premises
Three years after founding a subsidiary in Shenzhen in 2002, Alphasem has relocated to larger premises in Suzhou.
News from Alphasem, Oct 11, 2005
Milestone for die attach systems
Alphasem has set a production milestone by shipping its 250th second generation Swissline machine to North America.
News from Alphasem, Oct 11, 2005
Die bonder turns to sensor assembly
A new machine is the first to offer die bond technology proven in high volume production at an attractive price/performance ratio for the sensor and micro assembly market.
News from Alphasem, Oct 11, 2005
Optical films aid LCD backlighting
GE Advanced Materials is expanding its Illuminex diffuser film family of optical films for liquid crystal display backlighting applications into complete display solutions.
News from GE Advanced Materials, Oct 11, 2005
Diamond pad conditioners offer green advantage
Advanced Diamond Solutions is marketing two new diamond pad conditioner products, code-named ADD (Advanced Diamond Disk) and ODD (Organic Diamond Disk).
News from Advanced Diamond Solutions, Oct 10, 2005
Die attach systems prove popular
Alphasem has received an order for a further 18 Swissline die attach systems from Siliconware Precision Industries Co.
News from Alphasem, Oct 7, 2005
Die bonder suits Swiss sensor startup
Alphasem has delivered one of its new Easyline 8088 die bonders to Swiss startup Sensirion.
News from Alphasem, Oct 7, 2005
Pb-free alloy selection to be discussed in Texas
Indium Corporation's Pb-Free Programmes Manager, Tim Jensen, will discuss "The impact of Pb-free alloy selection on the SMT process" at the SMTA/IMAPS show on 11th October 2005.
News from Indium Corporation of America, Oct 6, 2005
Shi looks forward to lead-free challenge
Henkel has promoted Gary Shi to the position of Technical Manager for the Research and Development of Liquid Epoxy products.
News from Henkel Loctite Adhesives, Oct 5, 2005
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