Electronics manufacturing materials
(a sub category of Electronics manufacturing, packaging)
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Electronics manufacturing materials
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Showing 351-375 of 1014 articles
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RoHS compliant compound meets UL specs
Silicone rubber compound is certified to meet the specialist Underwriters Laboratory specifications UL50 "Enclosures for the electronic industry" and UL508 "Industrial control equipment".
News from MTI Leewood, Jan 16, 2007
Inserts ease enclosure assembly
Front-mounted inserts provide faster, more convenient and more cost-efficient alternatives to traditional rack mounting fasteners.
News from Southco, Jan 15, 2007
New roles for Jensen and Ross
Indium Corporation has named Tim Jensen as Product Manager for Advanced Assembly Materials and promoted Jordan Ross to Product Specialist for Thermal Applications.
News from Indium Corporation of America, Jan 11, 2007
Hupfer brings technical expertise
Identco International is continuing its successful expansion course by appointing Bruce Hupfer as Technical Director.
News from Identco International, Jan 11, 2007
Soft foam gaskets are RoHS compliant
EMI shielding specialist announces that its range of soft foam gaskets for EMI shielding meets the Restriction of Hazardous Substances Directive 2002/95/EC (RoHS Directive).
News from TBA Electro Conductive Products, Jan 9, 2007
Quality management system makes the mark
Swift Textile Metalizing has received ISO9001:2000 certification.
News from Swift Textile Metalizing, Jan 8, 2007
Potting and encapsulation gains full support
RF Bright Enterprises has become the sole UK distributor for Sika resin products for the electronics and components industry and a main distributor for Sika assembly adhesives and sealants.
News from RF Bright Enterprises, Jan 8, 2007
Software upgrades X-ray inspection system
Agilent Technologies has shipped its 8.4 software release with enhanced capabilities for the Medalist 5DX automated X-ray inspection (AXI) system.
News from Agilent Technologies Europe, Jan 4, 2007
UL to assist with due diligence on RoHS
Huntsman Corp has selected Underwriters Laboratories as its RoHS compliance partner.
News from Huntsman Advanced Materials, Dec 27, 2006
Thermally conducting resin bonds, coats and pots
Master Bond has completed in-use trial testing of EP21TDC-2AN, a highly flexible, two component, thermally conducting epoxy resin compound for high performance bonding, coating and encapsulation.
News from Master Bond, Dec 27, 2006
Adhesives are made for mounting image sensors
As the mobile handset image sensor market continues to expand at a rapid pace, new Loctite brand adhesive products meet the requirements of this significant high volume application.
News from Henkel Loctite Adhesives, Dec 22, 2006
Acquisition enhances semiconductor support
ASML is to acquire Brion, a leading provider of semiconductor design and wafer manufacturing optimisation solutions for advanced lithography.
News from ASML, Dec 20, 2006
Sales representative covers Michigan
Indium Corporation has signed BarTron as a sales representative for Michigan.
News from Indium Corporation of America, Dec 20, 2006
Self-adhesive dots speed board rework
Flextac wire dots are precut shapes of a thin, flexible polymer film membrane coated on one side with a high performance, electronics grade permanent pressure sensitive adhesive.
News from Intertronics, Dec 19, 2006
MacDermid Autotype rebranding complete
MacDermid Autotype has announced that from 1 January 2007 it is retiring the 'autotype in a box' logo that it has used for over 20 years.
News from MacDermid Autotype, Dec 15, 2006
Reduce damaged returns with smart label kits
Lamerholm Electronics has announced a special package deal for companies wanting to trial its range of damage deterrent labels.
News from Lamerholm Electronics, Dec 14, 2006
MMG Magdev attracts new director
MMG Magdev is pleased to announce the appointment of Forbes Crisell as Business Development Director.
News from MMG MagDev, Dec 14, 2006
New product catalogue for 2007
Anixter Components (formerly Heyco) celebrates the launch of its new 2007 product catalogue by offering 5% off all products ordered online by credit card.
News from Anixter Components, Dec 14, 2006
New home for ferrite materials supplier
MMG MagDev has continued with its rapid expansion by moving to new purpose-built premises in Swindon.
News from MMG MagDev, Dec 11, 2006
Indium Corporation receives award
Indium Corporation has received the 2006 Frost and Sullivan Global SMT Solder Paste Customer Value Enhancement Award.
News from Indium Corporation of America, Dec 7, 2006
EPREP labels replace engraved nameplates
Brady is now supplying engraved plate replacement labels, designed to replace engraved and printed nameplates for the identification of electrical components
News from Brady Corporation, Dec 4, 2006
Accelonix and CTS split French support
Indium Corporation has revealed its new sales structure in France.
News from Indium Corporation of America, Dec 4, 2006
Mini labels meet RoHS and WEEE requirements
New from Identco International are microminiature thermal transfer polyimide labels with a size of 4 x 4mm.
News from Identco International, Dec 4, 2006
Hynix standardises process development
Hynix Semiconductor, one of the world's leading memory manufacturers, has standardised on ASML's LithoCruiser software for the company's process development activity.
News from ASML, Dec 1, 2006
Packages chosen for military sensor programme
Egide has signed a 5 year agreement with US company Textron Systems.
News from Egide, Nov 29, 2006
Showing 351-375 of 1014 articles
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