Electronics manufacturing materials

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Electronics manufacturing materials

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Latest articles from 'Electronics manufacturing materials'

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Showing 501-525 of 1014 articles

Wave solder flux is environmentally friendly

Alpha EF-6100 low-solids wave solder flux is the latest addition to the EF Series of environmentally friendly fluxes

News from Cookson Electronics, Apr 11, 2006

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Shenzhen plant meets standards trifecta

On 7th March 2006, BSI officially presented three Business Management Certificates to Cookson Electronics' executives at their site in Shenzhen, China.

News from Cookson Electronics, Apr 11, 2006

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Award recognises help with switch to lead-free

Frost and Sullivan has selected Aegis Industrial Software Corp as its 2006 company of the year in the surface mount technology software sector.

News from Aegis Europe, Apr 10, 2006

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Rep's outstanding service is recognised

Indium Corporation has recognised Creyr Innovation, a representative for its assembly materials, for outstanding service and contributions during 2005.

News from Indium Corporation of America, Apr 10, 2006

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GaN-on-diamond wafer adds an extra option

Group4 Labs has released a gallium-facing gallium-nitride-on-diamond semiconductor water.

News from Group4 Labs, Apr 7, 2006

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Alliance on chemical mechanical planarisation

TMP and BASF have entered into a licence and joint development agreement for copper and barrier CMP slurries.

News from BASF, Apr 6, 2006

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Santhanasamy joins Asia-Pacific operations

Damian Santhanasamy has been recruited as Technical Engineer at Indium Corporation's Asia-Pacific Operations.

News from Indium Corporation of America, Apr 5, 2006

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Distributor takes electrochemicals to Thailand

Electrolube has strengthened its commitment to expanding business in Asia by announcing the appointment of N-Thai Electronics as exclusive distributor in Thailand.

News from Electrolube, Apr 4, 2006

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Lead-free materials to be experienced at Nepcon

Henkel will showcase several innovative solutions and Pb-free compatible material systems at the Nepcon UK 2006 Lead-Fee Experience.

News from Henkel Loctite Adhesives, Apr 3, 2006

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GaN-on-diamond wafers handle the heat

Group4 Labs has developed the world's first 2in gallium-nitride-on-diamond semiconductor wafer.

News from Group4 Labs, Apr 3, 2006

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Squeegee blade works with less pressure

The AMTX E-Blade electroformed squeegee blade improves print deposition, quality, uniformity and consistency.

News from Photo Stencil, Mar 30, 2006

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Lead-free paste set for launch at Nepcon

Almit Technology will extend its range of process-optimised solders by announcing a new lead-free paste at Nepcon UK this May.

News from Almit Technology, Mar 30, 2006

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Conductive plastic blocks more EMI

Two compounds achieve new levels of EMI shielding and electrical conductivity.

News from Chomerics Europe, Mar 30, 2006

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Environmental management meets ISO14001

Tecan has been granted ISO14001 status for its in-house environmental management systems.

News from Tecan, Mar 28, 2006

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Lead-free reliability in focus in Shanghai

Indium Corporation will highlight its reliability programme at Nepcon Shanghai Electronics Manufacturing Technology China from 4th to 7th April 2006.

News from Indium Corporation of America, Mar 24, 2006

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Wave solder flux is made in the UK

Indium Corporation has begun manufacturing wave solder fluxes in its European facility, located in Milton Keynes, UK.

News from Indium Corporation of America, Mar 22, 2006

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HF circuit material suits high density designs

Rogers Corporation will launch a high fill/flow version of the industry standard RO4450B Series high frequency circuit material at this year's Del Mar Electronics Show.

News from Rogers Corp, Mar 22, 2006

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Colour coded squeegees reduce risks

Colour coded squeegees help avoid cross contamination of tin-lead into lead-free solder paste.

News from SigmaPrint Technologies, Mar 20, 2006

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Rapid implementation of RoHS compliant assembly

Workshops provide an overview of the systematic approach for compliance, as well as information, tools and recommended resources to develop and execute a plan for WEEE and RoHS compliance.

News from Indium Corporation of America, Mar 20, 2006

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Plating switch cuts the cost of screening

A potential customer approached Photofabrication Services with a requirement for a price-sensitive three-part screening can set.

News from Photofabrication Services, Mar 20, 2006

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US Air Force funds solar cell research

The US Air Force is to award Advanced Diamond Solutions an SBIR Phase I Grant for research on high efficiency amorphous diamond solar cells.

News from Advanced Diamond Solutions, Mar 16, 2006

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Birthday celebrations for Indium

Indium Corporation is celebrating its 72nd birthday, having been set up in a garage in Utica, New York in March 1934.

News from Indium Corporation of America, Mar 15, 2006

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Fuel cell technology makes power from formic acid

BASF is working with Tekion, a North American developer of micro fuel cells for portable electronic products, to develop and fuel cell technology that uses formic acid as the fuel.

News from BASF, Mar 15, 2006

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Gaskets form strong yet flexible shields

Three new beryllium copper EMI/RFI shielding strips offer enhanced strength with improved flexibility.

News from TBA Electro Conductive Products, Mar 14, 2006

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Laser-markable labels are made to survive

A new line of laser-markable labels is designed for use in demanding environments.

News from Brady Corporation, Mar 14, 2006

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Showing 501-525 of 1014 articles

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