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Electronics manufacturing materials

(a sub category of Electronics manufacturing, packaging)

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Electronics manufacturing materials

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Latest articles from 'Electronics manufacturing materials'

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Showing 451-475 of 1014 articles

Acquisition expands PCB materials portfolio

In a move that demonstrates its ongoing commitment to the PCB industry, Electra Polymers has bought Rohm and Haas Electronic Materials' inks business.

News from Electra Polymers, Jun 23, 2006

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Fasteners have the right angle onboard

Surface mount R'Angle fasteners offer an efficient and reliable method to create permanent right-angle attachment points on printed circuit boards.

News from PennEngineering, Jun 21, 2006

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Concoat adopts new identity

Following its acquisition last year by Chase Corporation, Concoat has changed its name to HumiSeal Europe, reflecting the global nature of HumiSeal's business.

News from HumiSeal Europe, Jun 20, 2006

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Rep appointment covers Eastern Canada

Indium Corporation has appointed SMT Industrial Supply as its representative for Eastern Canada.

News from Indium Corporation of America, Jun 19, 2006

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Ink makes its mark on electronics

A new alcohol- and chemical-resistant ink provides clear, durable parts-marking results for the electronics industry.

News from Linx Printing Technologies, Jun 15, 2006

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Substrate helps ECU withstand transmission mount

A multilayer ceramic substrate is used in an electronic control unit on the most advanced automatic transmission produced by Aisin AW.

News from Kyocera Corp, Jun 14, 2006

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Medical sensor maker receives die bonder

Merit Sensor has received its first Alphasem Easyline 8088 "sensor bonder".

News from Alphasem, Jun 13, 2006

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Materials to make debut in San Francisco

Innovative materials technologies on show at Semicon West aim to deliver new levels of cost and production efficiencies for modern packaging processes.

News from Henkel Loctite Adhesives, Jun 13, 2006

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Ceremony promotes Chinese high-tech zone

LGInternational participated in a recent ceremony organised by the Wuxi Municipal Government to promote the Wuxi National High-Tech Industrial Development Zone.

News from LGInternational, Jun 12, 2006

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Promotion for Ossmann

Alphasem has appointed Christian Ossmann as European Sales Manager to strengthen its position within the first level packaging market.

News from Alphasem, Jun 12, 2006

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Website opens access to conductive fabric

A new consumer website allows customers to buy small amounts of Shieldex fabric and yarn without minimum order quantities or setup charges.

News from Shieldex Trading, Jun 8, 2006

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Screen print chemicals to be made in the UK

CPS Chemical Products and Services is to open a new UK manufacturing facility at the European headquarters of its sister company, MacDermid Autotype.

News from MacDermid Autotype, Jun 5, 2006

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RoHS website provides first aid for manufacturers

A new RoHS First Aid Kit provides emergency assistance to design engineers trying to meet the requirements of the 1st July 2006 law.

News from Farnell InOne, Jun 5, 2006

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Shielding strips fill narrow gaps

Small size beryllium copper EMI/RFI shielding strips are designed for use in applications where very narrow gaps are encountered.

News from TBA Electro Conductive Products, May 31, 2006

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Stencils pass paste transfer test

Photo Stencil has revealed the results of Universal SMT Laboratories' independent, extensive study, conducted in February 2006.

News from Photo Stencil, May 25, 2006

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Silicone materials support LED manufacture

Dow Corning Corporation has launched an expanded family of silicone materials for the fast-growing light emitting diode (LED) market.

News from Dow Corning, May 25, 2006

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Tests show promise of SAC-based solder pastes

Research into screen printing for 0201 SMT components using SnPb and SAC solder pastes concludes that SAC pastes have an inherently wider process window.

News from DEK, May 24, 2006

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Lithography systems prove popular

ASML Holding expects Q2 2006 order entry to be at least 40% higher than Q1 2006 net bookings of 62 lithography systems.

News from ASML, May 24, 2006

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Flux boosts BGA bumping yields

A high-viscosity water-soluble interconnect flux offers high yields in the BGA bumping process.

News from Indium Corporation of America, May 22, 2006

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Lead-free solder reliability in focus

Dr Yan Liu will review her findings on the reliability of lead-free soldering in a presentation to be delivered at the SMTA/CAVE Harsh Environment Electronics Workshop in Indianapolis.

News from Indium Corporation of America, May 22, 2006

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Protection grommets are easy to install

A new range of snap-in grommets are used to grip and seal cables into enclosures, installation cabinets or other thin plates and sheets.

News from Anixter Components, May 18, 2006

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Labelling solutions aid RoHS compliance

LGInternational, manufacturer of advanced labelling solutions, has announced its new RoHS compliance programme.

News from LGInternational, May 16, 2006

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Warehouse and website upgraded

Shieldex Trading has recently expanded its facilities with the addition of a new 93m2 warehouse to the existing office and manufacturing site.

News from Shieldex Trading, May 16, 2006

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Paste keeps pins clean for testing

Lead-free no-clean solder paste promises unparalleled pin testability, while allowing high print speeds and delivering excellent throughput and yield.

News from Cookson Electronics, May 15, 2006

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Gas contracts prepare for Taiwanese fab expansions

Air Products San Fu Gas has signed major contracts with Taiwan Semiconductor Manufacturing Company and Chi Mei Optoelectronics.

News from Air Products, May 12, 2006

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