
Electronics manufacturing materials
(a sub category of Electronics manufacturing, packaging)
Add this sub-category to My Alerts
Electronics manufacturing materials
A - Z list of suppliers
Click on a letter below to find a supplier...
Latest articles from 'Electronics manufacturing materials'
News releases from this sub-category
Showing 26-50 of 1014 articles
- first
- 1
- 2
- 3
- 4
- 5
- 6
- 7
- 8
- 9
- 10
- 11
- 12
- 13
- 14
- 15
- 16
- 17
- 18
- 19
- 20
- 21
- 22
- 23
- 24
- 25
- 26
- 27
- 28
- 29
- 30
- 31
- 32
- 33
- 34
- 35
- 36
- 37
- 38
- 39
- 40
- next
Precursors support DRAM and PRAM advancements
Air Products has introduced its Extrema STO and GST precursors in support of continuous advancements in Dynamic Random Access Memory (DRAM) and Phase-Change Random Access Memory devices (PRAM).
News from Air Products, Jun 8, 2010
Eco-friendly cleaners suit industrial environments
Intertronics' environmentally friendly Techspray Renew products have been designed for cleaning and degreasing in engineering, electronics and laboratory applications.
News from Intertronics, May 31, 2010
Lord adhesive for electronics, LED and solar uses
Lord has released a low-modulus, high-thermal-conductivity adhesive suitable for the electronics, LED and solar industries.
News from Lord, May 13, 2010
Electrolube to exhibit NVOC conformal coatings
Electrolube, a manufacturer of electro-chemicals for the electronics, automotive and industrial manufacturing industries, will be presenting its full product range at National Manufacturing Week.
News from Electrolube, May 11, 2010
Liner-barrier film for advanced memory devices
Novellus Systems has developed a Directfill CVD tungsten nitride (WN) liner-barrier film for the tungsten via to copper interconnect application in advanced memory devices.
News from Novellus Systems, May 10, 2010
Rogers shows laminates for stripline circuits
With its low loss and low dielectric constant of 1.96 at 10 GHz, Rogers' RT/duroid 5880LZ laminates are suitable for exacting stripline and microstrip circuits, including airborne antennas.
News from Rogers, May 5, 2010
Laird introduces Tlam SS LLD PCB substrate
Laird Technologies has released its enhanced Tlam SS LLD for use as a thermally conductive printed circuit board (PCB) substrate.
News from Laird Technologies, Apr 19, 2010
Dymax silicone cures to depth within seconds
Intertronics has brought out the Dymax Cure-Point 9440-A/B silicone, which cures to depth within seconds upon exposure to UV/visible light.
News from Intertronics, Apr 9, 2010
Bioact Defluxers clean residues in aqueous systems
The Bioact EC-88 Inline Defluxer and Bioact EC-98 Ultrasonic Defluxer clean lead-free and high-temperature solder-paste residues in aqueous cleaning systems.
News from Petroferm, Mar 25, 2010
Conductive plastic enhances fuel resistance
Chomerics has introduced a new version of its Premier conductive-plastic shielding material that offers enhanced fuel resistance and heat-deflection-under-load (HDUL) specifications.
News from Chomerics, Mar 23, 2010
Deposition Sciences provides LWIR bandpass filters
Deposition Sciences provides long wavelength infrared (LWIR) bandpass filters with good operation at any temperature between ambient and 10-deg K.
News from Deposition Sciences, Mar 10, 2010
STI offers cable assembly kits and training
STI Electronics has introduced cable assembly kits and training to support customers involved in cable and harness assembly.
News from STI Electronics, Mar 8, 2010
Binder launches torque wrench for 850 connectors
Binder-USA has announced the release of a torque wrench for its 7/8in series 820 connectors.
News from Binder, Feb 24, 2010
Vero Technologies unveils Fotoboard PCBs
Vero Technologies has introduced Fotoboard, a range of single and double-sided blank Eurocard PCBs, covered with photosensitive resist.
News from Vero Technologies, Feb 24, 2010
Soitec produces silicon-on-insulator substrates
Soitec has announced volume production of its new generation of high-resistivity (HR) silicon-on-insulator (SOI) substrates to serve the mobile phone and wifi markets.
News from Soitec, Feb 22, 2010
Permabond adhesive has fast fixture time
Permabond 820 is a modified ethyl cyanoacrylate that has a fast fixture time and temperature resistance up to 200C.
News from Permabond, Feb 19, 2010
BLT offers support for solder paste and wires
BLT Circuit Services has announced the stocking, sales and technical support of the Sn100C solder paste and solder wires manufactured by AIM Solder.
News from BLT Circuit Services, Feb 16, 2010
Steierform self-adhesives for SMD processing
MR Technical Services has unveiled the Steierform range of self-adhesive products designed to assist in eliminating some of the production problems associated with SMD processing.
News from MR Technical Services, Feb 8, 2010
Filters utilise hydrophilic PTFE filtration media
Gore and Associates has added hydrophilic PTFE filters to its line of cartridge filters for bulk high-purity chemicals used in microelectronics manufacturing, including LCDs and semiconductors.
News from Gore and Associates, Feb 2, 2010
LED encapsulant material is self bonding
Momentive Performance Materials has developed IVS4742, a self-bonding LED encapsulant material with a viscosity and clarity that enables low-pressure direct-onboard lens moulding.
News from Techsil, Jan 20, 2010
Pick-and-place tool is top activated
Virtual Industries has introduced the Vacula VC-3 heavy-duty Vacuum-Tweezer, a self-contained pick-and-place tool that is activated from the top.
News from Virtual Industries, Jan 5, 2010
Snaptron introduces range of metal dome switches
Snaptron has introduced a series of metal dome switches designed with high actuation forces and long-life specifications.
News from Snaptron, Dec 14, 2009
Rogers introduces Poron self-adhesive seal
Rogers has introduced Poron Thinstik Soft Seal to its range of self-adhesive solutions for handheld devices.
News from Rogers Corp, Dec 10, 2009
ECM materials offer long-lasting solar power
Krayden has announced that it will supply Engineered Conductive Materials' (ECM) solar-cell conductive adhesives and inks to the solar industry.
News from Krayden, Dec 9, 2009
Adhere IRS2012 suits weight-critical applications
Intertronics have come up with an advanced, lightweight epoxy potting technology that brings density down to 0.6.
News from Intertronics, Dec 3, 2009
Showing 26-50 of 1014 articles
Add this sub-category to My Alerts
Electronics manufacturing materials
Not what you're looking for? Search the site.
Featured articles

- Technique splices optical fibres in communications
Lightcrimp splice technology is a new rapid technique for splicing optical fibres in communications networks. - DEK stencil wipe reduces cleaning frequency
DEK introduces a stencil coating technology, the Nano-Protek wipe, which is designed to increase cleaning effectiveness and reduce cleaning frequency as it renders the stencil surface 'fluxophobic'.

Browse by category
- Active components (13484)
- Passive components (3570)
- Design and development (10238)
- Enclosures and panel products (3950)
- Interconnection (3604)
- Electronics manufacturing, packaging (3477)
- Industry news (2104)
- Optoelectronics (1952)
- Power supplies (2978)
- Subassemblies (5602)
- Test and measurement (5768)