Electronics manufacturing materials
(a sub category of Electronics manufacturing, packaging)
Add this sub-category to My Alerts
Electronics manufacturing materials
A - Z list of suppliers
Click on a letter below to find a supplier...
Latest articles from 'Electronics manufacturing materials'
News releases from this sub-category
Showing 776-800 of 1014 articles
- first
- 1
- 2
- 3
- 4
- 5
- 6
- 7
- 8
- 9
- 10
- 11
- 12
- 13
- 14
- 15
- 16
- 17
- 18
- 19
- 20
- 21
- 22
- 23
- 24
- 25
- 26
- 27
- 28
- 29
- 30
- 31
- 32
- 33
- 34
- 35
- 36
- 37
- 38
- 39
- 40
- next
Power semiconductor materials focus of trade show
At the 37th International Symposium on Microelectronics November 16-18, 2004, Indiumıs exhibit will focus on Power Semiconductor Materials, such as Solder Wire, Solder Preforms and Solder Paste.
News from Indium Corporation of America, Nov 8, 2004
Resins for visual effects in China
GE Advanced Materials unveiled a new line of Visualfx special-effects resins that were carefully engineered to match color trends and preferences of the domestic Chinese market.
News from GE Advanced Materials, Nov 8, 2004
High definition overlays from polyester film
Autotex polyester films from Autotype International are being used by Danielson to enable the company to produce high definition, photographic quality keyboard overlays from screen printing systems.
News from Autotype, Nov 5, 2004
Exclusive deal for dicing tape
Advantek has gained exclusive sales, marketing and distribution rights for Neptco's Wafertape products.
News from Advantek (UK), Nov 3, 2004
New flexible, low viscosity potting compound
A new easy-to-use, low viscosity epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond.
News from Master Bond, Nov 3, 2004
Germanium Chemicals Division gains ISO9001:2000
Indium Corp of America's Germanium Chemicals Division has passed its ISO9001:2000 certification audit.
News from Indium Corporation of America, Oct 28, 2004
Cost-effective RFI screening solutions
Tecan offers a "total screening" service which is dedicated to the cost-effective delivery of both standard and custom solutions, from design to prototype and volume production.
News from Tecan Components, Oct 26, 2004
PCB accessories include 12 types of spacers
A new range of printed circuit board (PCB) accessories complements the extensive product portfolio from Moss Plastic Parts.
News from Moss Plastic Parts, Oct 25, 2004
Bobet covers Arizona
Indium Corporation of America is now represented in the Arizona area by Bobet Corp.
News from Indium Corporation of America, Oct 22, 2004
Water-soluble lead-free paste set to clean up
Indium3.1 is a water-soluble Pb-free solder paste with exceptional printing, ideal for fine-pitch applications.
News from Indium Corporation of America, Oct 19, 2004
New plant to service Taiwan LCD manufacturers
SDK will begin production of high-purity ammonia in Taiwan from May 2005 through a new subsidiary that will build a 1000-ton-a-year plant at Tainan.
News from SDK, Oct 18, 2004
China facility opens
Indium Corp has opened a new facility in China, combining solder paste manufacturing and quality operations with fully integrated sales and technical support teams.
News from Indium Corporation of America, Oct 11, 2004
Soft gel grommets cushion PCBs from shock
Gel-Mec's range of soft gel grommets are ideal for cushioning sensitive PCBs and other light components.
News from Gel-Mec UK, Oct 7, 2004
Stencils ensure accurate rework
A new range of PCB rework stencils ensures accurate and repeatable printed results for single component footprints such as QFPs, PLCCs, BGAs, uBGAs and surface-mount connectors.
News from Tecan Components, Oct 7, 2004
Website is gateway to family of global brands
OK International has launched a redesigned and greatly expanded web presence.
News from OK International, Oct 6, 2004
Materials experts cover US trade shows
Indium Corp of America will be exhibiting at a number of regional SMTA trade shows during the month of October.
News from Indium Corporation of America, Oct 1, 2004
Smaller carbon fibres aid conductivity
VGCF-S is a new grade of carbon nanofibre suitable for addition to resins in which electrical conductivity is required.
News from SDK, Sep 29, 2004
Flux is optimised for Pb-free wave soldering
Wave solder flux 3592-35 has been specifically developed for the Pb-free wave soldering of mixed-technology and through-hole electronic assemblies.
News from Indium Corporation of America, Sep 28, 2004
DTI grant aids research into nano devices
Applied Microengineering has been awarded a DTI grant of GBP 678,000 to develop a new production tool to help the manufacture of nano devices - the Lobel project.
News from Applied Microengineering, Sep 27, 2004
Nickel layer stops packages sprouting tin whiskers
Agere Systems reckons its engineers have found the right mix of packaging ingredients to enable the semiconductor industry to successfully implement lead-free packaging.
News from Agere Systems, Sep 23, 2004
Lee to tell all on lead-free soldering
Dr Ning-Cheng Lee will present a workshop entitled "Lead-free soldering - metallurgical fundamentals, reflow application and challenges", at the CEMCEX Conference.
News from Indium Corporation of America, Sep 17, 2004
Ceramic packaging expertise on show in Munich
AdTech Ceramics will introduce its multilayer cofire ceramic capabilities at Electronica 2004.
News from AdTech Ceramics, Sep 6, 2004
Pb-free explained at Assembly Technology Expo
Indium Corporation of America will exhibit at Assembly Technology Expo (Booth 5631) in Rosemont, Illinois on from 28th to 30th September 2004.
News from Indium Corporation of America, Sep 6, 2004
Semiconductor leadframes made to order
Tecan is now routinely producing high-accuracy bespoke semiconductor leadframes it claims deliver a range of inherent benefits compared with traditional "stamped" products.
News from Tecan Components, Sep 1, 2004
Summit educates technical support team
Indium Corporation of America held its annual global technical summit recently in Clinton, New York.
News from Indium Corporation of America, Aug 30, 2004
Showing 776-800 of 1014 articles
Add this sub-category to My Alerts
Electronics manufacturing materials
Not what you're looking for? Search the site.
Featured articles
- Technique splices optical fibres in communications
Lightcrimp splice technology is a new rapid technique for splicing optical fibres in communications networks. - DEK stencil wipe reduces cleaning frequency
DEK introduces a stencil coating technology, the Nano-Protek wipe, which is designed to increase cleaning effectiveness and reduce cleaning frequency as it renders the stencil surface 'fluxophobic'.
Browse by category
- Active components (13484)
- Passive components (3570)
- Design and development (10238)
- Enclosures and panel products (3950)
- Interconnection (3604)
- Electronics manufacturing, packaging (3477)
- Industry news (2104)
- Optoelectronics (1952)
- Power supplies (2978)
- Subassemblies (5602)
- Test and measurement (5768)
