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Electronics manufacturing materials

(a sub category of Electronics manufacturing, packaging)

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Electronics manufacturing materials

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Latest articles from 'Electronics manufacturing materials'

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Showing 801-825 of 1014 articles

Novel design process boosts package performance

A new custom package design process can yield market differentiating performance while maintaining cost effective solutions.

News from AdTech Ceramics, Aug 20, 2004

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Luxeon diodes placed and soldered in one

A flexible new system is ideal for hot-bar soldering of small volumes Luxeon emitter terminals.

News from Ivas Tech, Aug 13, 2004

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Online tool helps assess lead-free readiness

A new online, interactive tool aims to help manufacturers prepare for a Pb-free work environment.

News from Indium Corporation of America, Aug 13, 2004

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Soldering tips cut the cost of lead-free working

A new family of Weller lead-free soldering tips (LT/LF) from Cooper Tools offers superior operational life at prices up to six times less than those of the current equivalent market leading products.

News from Cooper Tools, Aug 11, 2004

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Table details cleaning solvent compatibility

Indium Corp of America has released the results of a series of cleaning solvent compatibility evaluations.

News from Indium Corporation of America, Aug 10, 2004

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Progressive support for New York users

Indium Corp is now represented in the Central New York area by Progressive Technologies, which will service and sell Indium's complete line of assembly products.

News from Indium Corporation of America, Aug 6, 2004

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Handtool speeds contact crimping

Anderson Power Products has developed a versatile hand tool for crimping its PowerMod and Power Drawer series contacts.

News from Anderson Power Products, Aug 2, 2004

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Flux eases BGA bumping

WS-364 is a new high viscosity paste-flux for use in BGA bumping and board level attachment.

News from Indium Corporation of America, Jul 30, 2004

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Optical couplant helps LEDs shine brighter

SmartGel is a novel optical couplant that helps LEDs shine brighter, last longer and survive extreme environments.

News from Newgate Simms, Jul 28, 2004

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Purity is key for die attach solder wire

Indium Corp's die attach solder wire is manufactured from high-purity (minimum 99.9% pure) materials with controlled oxide levels to enhance wetting performance.

News from Indium Corporation of America, Jul 22, 2004

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Scientist wins award for AuSn solder research

Micralyne Project Scientist, Dr Siamak Akhlaghi, has received a Silver Medal Award from the American Electroplaters and Surface Finishers Society (AESF).

News from Micralyne, Jul 16, 2004

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McLenaghan supports New England

Indium Corporation of America is now represented in the New England area by Jim McLenaghan, President of Creyr Innovation.

News from Indium Corporation of America, Jul 15, 2004

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Upgraded control for process chemicals

Air Products has released the next generation of its ATCS absolute temperature control system for the electronics specialty chemicals market.

News from Air Products, Jul 13, 2004

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Conductive adhesive comes in handy syringe

The two-part Cho-Bond 584-29 conductive adhesive now comes in a convenient syringe system that allows easier mixing and more precise application.

News from Chomerics Europe, Jul 13, 2004

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European role for Salmon

Indium Corp has hired Paul Salmon as Director of Marketing for Indium of Europe.

News from Indium Corporation of America, Jul 13, 2004

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Novel sheet provides mobile screening

SDK has developed a halogen-free, heat-resistant electromagnetic wave absorption sheet that controls noise and prevents malfunctioning of mobile electronic devices.

News from SDK, Jul 5, 2004

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SMTA Certification for Low

Adrian Low from Indium Corp has achieved SMTA Certification in the SMT process.

News from Indium Corporation of America, Jul 2, 2004

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Richco fastens on to Micromark

Micromark C and CD has significantly expanded its range of fixing and fastenings for electronics applications through a new partnership with Richco for its range of high-quality plastic components.

News from Micromark C and CD, Jun 30, 2004

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Solder clad preforms speed assembly operations

Solder preforms, clad to various other metals, are available from the Indium Corp.

News from Indium Corporation of America, Jun 29, 2004

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Optical fluid is radiation hardened

SantoLight SL-5267 is a nonvolatile, nontoxic, radiation-hardened optical fluid designed especially for optical coupling and light transmission in photonics, display and high-power laser applications.

News from Intertronics, Jun 28, 2004

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New source for high-reliability ceramic packaging

Advanced Technical Ceramics Company has established a multilayer cofired ceramic facility in Chattanooga, Tennessee.

News from AdTech Ceramics, Jun 25, 2004

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Potting gel is clearly better protection

Lightspan LS-3238 optical gel is a soft encapsulation material designed to protect sensitive photonics and fibre-optic modules from mechanical or thermal shock, dust and moisture.

News from Intertronics, Jun 23, 2004

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Gel provides protection for optoelectronics

Lightspan LS-3252 optical gel is a soft encapsulation material designed especially for protection of sensitive photonics and flat panel display assemblies.

News from Intertronics, Jun 18, 2004

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Devine rises to management role

Indium Corp has promoted Leo M Devine to Market Development Manager for Wave Solder Products.

News from Indium Corporation of America, Jun 17, 2004

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Three move up at Indium

The Indium Corporation of America has promoted three members of its engineering team.

News from Indium Corporation of America, Jun 15, 2004

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Showing 801-825 of 1014 articles

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