IC and hybrid processing equipment
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IC and hybrid processing equipment
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Latest articles from 'IC and hybrid processing equipment'
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Showing 1-25 of 228 articles
SPP supplies Pegasus DSi Deep Silicon etch system
SPP Process Technology Systems (SPTS) has received an order for a Pegasus DSi Deep Silicon etch system, supported on the Omega FXP cluster platform, for a 3D-IC through silicon via (TSV) application.
News from SPP Process Technology Systems, Jun 2, 2010
SM packages suit optical devices in aerospace apps
Stratedge's SM range of packages fits aerospace, avionics, automotive and telecom-industry applications, and is especially suited for LEDs, MEMS and optical devices.
News from Stratedge, May 31, 2010
Nanofab tool influences nanostructure growth
Oxford Instruments Plasma Technology (OIPT), has launched the Nanofab800Agile System.
News from Oxford Instruments Plasma Technology, Sep 7, 2009
DEK introduces wafer-processing system
DEK has developed the Galaxy thin silicon wafer processing system.
News from DEK, Aug 4, 2009
Oxford Instruments releases HVPE reactor
Oxford Instruments has launched Crystalflex, a multi-wafer hydride vapour-phase epitaxy (HVPE) reactor.
News from Oxford Instruments Plasma Technology, May 18, 2009
Atmel develops cryptographic authentication ICs
Atmel Corporation has announced its AT88SA range of low-cost, ultra-low power, super-secure cryptographic authentication ICs.
News from Atmel Corporation, Apr 30, 2009
Oxford Instruments produces semi-polar GaN layers
The technical team at Oxford Instruments-TDI, led by Dr Alexander Usikov, is working closely with a light-emitting diode (LED) manufacturer to make semi-polar GaN layers for optoelectronic devices.
News from Oxford Instruments Plasma Technology, Mar 12, 2009
ALD tool improves solar cells
Researchers have developed a thin-film coating providing an unparalleled level of surface passivation of crystalline silicon solar cells, using Oxford Instruments' FlexAL ALD tool.
News from Oxford Instruments Plasma Technology, Feb 18, 2009
TDI advances HVPE technology
TDI, an Oxford Instruments company, has recently advanced the Hydride Vapour Phase Epitaxy (HVPE) technology to the growth of InGaN.
News from Oxford Instruments Plasma Technology, Oct 24, 2008
SAFC launches high-purity halide range
SAFC Hitech has introduced a line of high-purity halides, which will enable the growth of scintillation detector crystals.
News from SAFC Hitech, Oct 21, 2008
Challenger promotes circular connector range
Challenger Components is promoting the Ecomate circular connector series from Amphenol-Tuchel Electronics.
News from Challenger Components, Oct 10, 2008
Module advances chemical vapour etching
Breakthrough chamber design and improved wafer handling makes XeF2 a viable process for high volume production.
News from Surface Technology Systems, Aug 4, 2008
High-power green lasers help make solar cells
The Starlase range now addresses a multitude of applications on commonly used substrates including those used in the manufacture of solar cells.
News from Powerlase, Jul 31, 2008
Ion beam tools explained
Ion beam technology tool offerings are suitable for both R and D and batch production capabilities.
News from Oxford Instruments Plasma Technology, Jul 28, 2008
Wire bonder offers extended table travel
The Bondjet BJ820 platform handles 12.5 to 85um diameter wire bonding and ribbon bonding from 6 x 35 to 25 x 250um.
News from Hesse & Knipps, Jul 28, 2008
Gas delivery improves LCD manufacture
The VHF is specifically designed to address the needs of IC, PV and thin-film transistor liquid crystal display manufacturers.
News from Air Products, Jul 23, 2008
System provides fine vapour control
EpiVapor provides gas phase delivery of chemical vapours such as trimethylgallium (TMG) and trimethylaluminium (TMA) directly to multiple deposition tools in a safe, reproducible fashion.
News from SAFC Hitech, Jun 3, 2008
Strip systems target both ends of IC market
Dry strip and clean systems address high throughput and low defectivity requirements for Flash, DRAM and logic applications.
News from Novellus Systems, May 20, 2008
Wedge bonder handles varied wires
The Bondjet BJ820 handles all challenging fine pitch wire bonding applications in a single platform, including RF and microwave devices, COB, MCM and hybrids, fibre optics and automotive applications.
News from Hesse & Knipps, May 8, 2008
Flying probes promote precision trimming
Laser trimming systems for capacitors and resistors use flying probes for feedback rather than fixed probe cards for economical operations on small batches.
News from LS Laser Systems, Apr 14, 2008
Lasers boost semiconductor research
The Powerlase lasers will enable the development of the DPP source for lithography steppers, which are used for the fabrication of semiconductors.
News from Powerlase, Apr 10, 2008
Silicon engineering to upgrade DRAM production
MST for CMOS will improve overall chip performance and reduce static power without introducing any new materials into existing manufacturing process flows.
News from Mears Technologies, Mar 21, 2008
Wire bonders move to next generation
Series offers higher accuracy over a larger bondable area, and represents the most technologically advanced assembly equipment in the market.
News from Kulicke and Soffa Industries, Mar 18, 2008
Process tool systems ordered for research complex
Nine systems will provide University of Southampton with leading-edge capabilities in the research and development of novel nanoelectronic, MEMS and photonic devices.
News from Oxford Instruments Plasma Technology, Dec 20, 2007
Dry etch deprocessing is enhanced
Plasma Accelerator delivers increased etching speeds, superior duplication rates, straightforward operation and low damage.
News from Oxford Instruments Plasma Technology, Dec 5, 2007
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