Electronics manufacturing materials
(a sub category of Electronics manufacturing, packaging)
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Electronics manufacturing materials
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Military technology provides moisture protection
Ion-mask enhancement provides manufacturers with a 21st century solution to waterproofing electrical items and componentry.
News from P2i, Nov 8, 2007
Flexible silicone coating to launch in Munich
Fast-drying silicone-based conformal coating is designed to protect printed circuit boards exposed to high humidity environments.
News from Electrolube, Nov 5, 2007
Alcohol wipes improve adhesive bonds
ADH1610 wipes are suitable for the removal of fluxes, light oils, polar soils, dirt, inks and oxides
News from Intertronics, Nov 2, 2007
Placement system provides speed and reliability
High-speed image processing software provides a 100 % quality check of BGA and fine pitch components prior to placement.
News from Contax, Nov 1, 2007
System doubles printing output
DEK's new solution delivers full in-line production at high speed, while occupying a significantly reduced line footprint.
News from DEK, Oct 31, 2007
Programme develops barriers
The Systems-in-Foil programme develops advanced polymeric materials for use in innovative barrier structures.
News from Huntsman Advanced Materials, Oct 25, 2007
Waveguide finishes offer choice of properties
Gold- and silver-based plating finishes provide flexible surface properties for custom waveguides in aerospace, defence, medical, security scanning and comms applications.
News from Tecan, Oct 24, 2007
Coating suits high volume applications
1H20 AR3 can protect electronics assemblies at temperature extremes far beyond the capabilities of existing resin-based alternatives.
News from HumiSeal Europe, Oct 17, 2007
Ionic liquid partnership targets solar cells
A partnership between G24 Innovations (G24i) and BASF aims to improve both the performance and efficiency of G24i's solar cells using a proprietary dye-sensitised thin film technology.
News from BASF, Oct 12, 2007
Coating avoids VOC use
NVOC has been produced for application via select spray equipment and to replace solvent-based coatings with minimal changes to processing parameters.
News from Electrolube, Oct 12, 2007
Silver conductor pastes suit solar cells
The D-110, D-112 and D-114 silver conductor pastes are targeted at display bus bar electrodes.
News from Five Star Technologies, Oct 5, 2007
Ceramics expertise on show in Stuttgart
Injection moulding technology combines a proven alumina material system with cofire metallisation, and offers complex shape capabilities with no additional machining required.
News from AdTech Ceramics, Sep 24, 2007
Polymer company tailors solutions
Simply specifying a chemistry presupposes a solution without a review of other complex factors and specific performance requirements, which will likely result in a suboptimum solution.
News from Lord Corporation, Sep 19, 2007
Deposition masks suit vacuum applications
Tecan's electroforming process produces tightly toleranced display masks with burr-free aperture edges and controllable draft angles to ensure optimum print definition.
News from Tecan, Sep 10, 2007
Encapsulant and potting agents are made for solar
Materials remain flexible and stable over wide temperature variations and offer easy reparability and global availability.
News from Dow Corning, Sep 7, 2007
PCB laminates answer RF demands
Laminates provide the controlled relative permittivity, low loss and passive intermodulation response required by the wireless infrastructure market.
News from Rogers Corp, Sep 7, 2007
Assembly labels resist high temperatures
Use of a green high-temperature label at the start of the process reduces both the number of labels required, and the number of label placements, providing a significant cost saving.
News from Link Hamson, Aug 31, 2007
Copper substrate handles high-current use
TT electronics IRC Advanced Film Division's cost-effective, solderable thick film copper substrate is now being specified for high-current and power module applications.
News from IRC Advanced Film Division, Aug 30, 2007
Encapsulants suit lead-free soldering
ME-532 flip chip underfill is specifically formulated to achieve high reliability for in-package or chip-on-board applications where fast flow under large chips is required.
News from Lord Corporation, Aug 28, 2007
Alliance addresses LED backlight expansion
Agreement gives Laird Technologies access to Iteq's high volume lamination capabilities and AP distribution and gives Iteq access to Laird Technologies' high performance T-lam materials.
News from Laird Technologies, Aug 27, 2007
3D interconnect structure recognised with patent
Patent covers new methods for making 3D liquid crystal polymer (LCP) interconnect structures using a high-temperature single-sided LCP and a low-temperature single-sided LCP.
News from Jacket Micro Devices, Aug 23, 2007
Dummy component lines brought up to date
Free catalogue is organised by package type and category with each product accompanied by drawings, description, part number with special attention to lead-free availability and formulations.
News from Practical Components, Aug 15, 2007
Ink system enables record-breaking cells
Organic photovoltaic technology establishes a new world record for single layer organic solar cells as certified by the US National Renewable Energy Laboratory.
News from Plextronics, Aug 10, 2007
Laminate system cleans up flex circuit designs
Halogen-free transparent epoxy polyimide laminate system is safe for the environment and delivers superior performance in an all-inclusive package for flexible circuit designs.
News from Rogers Corp, Aug 7, 2007
Labels meet Japanese RoHS requirements
Japanese RoHS labels allow exporters to mark electrical and electronic equipment in accordance with the Japanese Industrial Standard JIS C 0959:2005.
News from LGInternational, Aug 6, 2007
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