Die attach systems prove popular

Alphasem has received an order for a further 18 Swissline die attach systems from Siliconware Precision Industries Co.

The success story of Alphasem's Swissline die attach systems continues.

Alphasem recently received an order for 18 Swissline systems from Siliconware Precision Industries Co.

Urs Hirsiger, Sales Manager at Alphasem, considers SPIL's decision as "further proof of Swissline's unsurpassed flexibility for high-speed and high-precision die attach processes".

Swissline can handle ICs as well as CCD/CMOS applications.

It is the only die attach system on the market capable of both lamination (LOC/BOC) and dispense (BGA/FBGA) processes.

This wide range of applications provides manufacturers with the needed flexibility to deal with cyclical order situations.

The performance of the Swissline system induced SPIL to order from Alphasem again, building on a long-standing relationship of the two companies.

SPIL purchased its first Swissline first generation system in 1998, and with 120 systems in its production lines today, the Taiwanese manufacturer continues to count on Alphasem's technology leadership.

Another key reason for choosing Alphasem was the Swiss company's ability to guarantee quick delivery.

SPIL is a leading semiconductor manufacturer of IC packages used primarily in computers, cellphones, and digital cameras.

The order is part of SPIL's aggressive growth strategy and assures a more flexible and efficient infrastructure for the Taiwanese manufacturer.

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