Electronics manufacturing materials
(a sub category of Electronics manufacturing, packaging)
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Electronics manufacturing materials
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Electronic materials centre set to open in 2007
BASF has started construction of a new integrated production plant for process chemicals for the semiconductor industry.
News from BASF, Aug 28, 2006
Lead frames and moulding for electronic packages
Stamping, selective electroplating, joining and injection moulding are key contributors to the integration of lead frames for smart cards and other miniature semiconductor packaging applications.
News from Tyco Electronics UK, Aug 24, 2006
Beware of untested consumables
Linx Printing Technologies says that the escalating use of untested consumables in ink jet printers can have serious financial implications for users of the equipment.
News from Linx Printing Technologies, Aug 17, 2006
Liquid silicone is clearly superior
Opti-tec 7020 is a two-part clear liquid silicone which will cure at room temperature or can be accelerated at increased temperatures.
News from Intertronics, Aug 15, 2006
New group integrates extensive knowledge base
Cookson Electronics Assembly Materials has set up its Global Applications Technology and Engineering group, which joins its global R and D group.
News from Cookson Electronics, Aug 11, 2006
RO4230 high frequency circuit material
Rogers Corporation will introduce its RO4230 high frequency circuit material at this year's Antenna Systems Show.
News from Rogers Corp, Aug 2, 2006
Single source solution for EMC enclosures
Tecan has a division dedicated to the provision of EMC enclosures which is set up to offer advice and assistance, from initial concept through to volume manufacture
News from Tecan, Aug 2, 2006
Water-based conductive printing ink technology
Acheson Electronic Materials has introduced a novel, water-based conductive printing ink technology that provides manufacturers of RFID antennas with many production and performance advantages.
News from Acheson Colloids, Aug 2, 2006
IPC certifies 23 Cookson electronics engineers
Cookson Electronics Assembly Materials global team of 23 applications engineers were trained and certified as IPC Specialists in May
News from Cookson Electronics, Jul 28, 2006
Specialty material products at Chinese show
Rogers Corporation will be showcasing its wide range of specialty material products for use in demanding, high-technology applications at this year's China Hi-Tech Elexcon show in Shenzhen.
News from Rogers Corp, Jul 27, 2006
ASML nears billion-Euro quarter
ASML Holding has announced 2006 second quarter results with net sales of Eur 942 million.
News from ASML, Jul 21, 2006
SJ7 solder alloy from Almit Technology
SJ7's resultant ability to deliver a superior performance under highly challenging conditions is currently driving its widespread adoption in aerospace and military applications
News from Almit Technology, Jul 21, 2006
R/flex jade series flexible circuit materials
R/flex Jade series flexible circuit materials are the next generation of the industry-leading R/flex Crystal epoxy adhesive system.
News from Rogers Corp, Jul 21, 2006
3D wire bond checker is a winner
Amkor Technology has received the coveted Advanced Packaging Award in the Package Design Software and Equipment Category for its innovative 3D wire bond checker.
News from Amkor Technology, Jul 20, 2006
500th lithography system shipped
ASML marks technology and market leadership with shipment of 500th Twinscan system
News from ASML, Jul 13, 2006
ASML expands immersion product suite
ASML expands immersion product suite with introduction of advanced 40nm immersion system
News from ASML, Jul 13, 2006
Squeegees last longer with lead-free solders
Squeegees are infused with polymer lubricant which significantly reduces friction and stencil wear when using silver and tin solder alloys in all kinds of stencil printer.
News from Intertronics, Jul 7, 2006
Hardcoated film protects panels down the pit
The latest Autotex hardcoated polyester film is playing a crucial role in an innovative range of industrial control panels used in high performance mining systems.
News from MacDermid Autotype, Jul 6, 2006
Bondplys offer superior high frequency performance
Rogers will introduce its new RO4450B-dx bondply, a high fill/flow version of the industry standard RO4450B high frequency circuit material, at this year's European Microwave Week.
News from Rogers Corp, Jul 3, 2006
White paper reveals true costs of label printing
Research establishes the true comparative costs of preparing cable and patch panel labelling for real-world projects when using software-based tools compared with dedicated printing machines.
News from Silver Fox, Jul 3, 2006
Labels identify WEEE for processing
LGInternational has launched a line of WEEE labels for marking of electrical and electronic equipment.
News from LGInternational, Jul 3, 2006
New alcohol-resistant ink extends Linx range
Linx's extensive range of inks for Continuous Ink Jet (CIJ) printing has been enhanced with the launch of Linx Black ink 1075
News from Linx Printing Technologies, Jun 30, 2006
Reliability programme featured at Semicon West
Indium Corporation will highlight its Reliability Programme at its exhibit at Semicon West from 10th to 14th July 2006 at the Moscone Center in San Francisco.
News from Indium Corporation of America, Jun 27, 2006
Organic materials are made for P-OLED displays
CDT is to supply customised formulations of Starck organic materials used in the manufacture of P-OLED displays.
News from Cambridge Display Technology, Jun 27, 2006
Perpendicular recording boosts hard disk capacity
New 2.5in hard disk media offer storage capacity of 100Gbyte per disk using innovative perpendicular magnetic recording technology.
News from SDK, Jun 26, 2006
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