Electronics manufacturing materials
(a sub category of Electronics manufacturing, packaging)
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Electronics manufacturing materials
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Taping machines get to grips with coplanarity
Adaptsys can now offer true 3D optical coplanarity inspection for V-Tek taping machines.
News from Adaptsys, May 12, 2006
Pick and place machines configured to order
AlternativeSMT has developed an innovative approach to selling second user SMT assembly equipment by supplying Fuji QP242 pick and place machines configured to order.
News from Alternative SMT, May 11, 2006
Stencils compensate for device inconsistency
Electronic components with mechanically formed leads continue to cause problems as their poor lead coplanarity regularly results in inconsistent solder fillets and open circuits.
News from Tecan, May 8, 2006
Laser-cut templates aid process verification
Photo Stencil can now offer precision component verification inspection templates to its customers, directly from its worldwide headquarters.
News from Photo Stencil, May 5, 2006
Die bonders gain integrated tape applicator
A new integrated tape applicator meets the stringent process requirements of leading-edge stacked-die package assembly in the high-volume manufacturing environment.
News from Alphasem, May 4, 2006
Award for high frequency circuit material
Rogers Corporation was one of two companies awarded recognition for the most innovative products in an awards ceremony at the Del Mar Electronics Show in April.
News from Rogers Corp, May 4, 2006
Chinese website answers Asian expansion demands
Rogers Corporation has created a new website for the Chinese market.
News from Rogers Corp, May 2, 2006
Materials make light of bonding optics
Two-part epoxy systems and other materials are specially designed for optical applications.
News from Intertronics, Apr 28, 2006
Aluminium foil output set to rise
SDK is to increase its production of high-purity aluminium foils for electrolytic capacitors used in cars and digital equipment.
News from SDK, Apr 25, 2006
Novel materials absorb microwaves
Microwave absorbers are increasingly being used to enhance shielding performance at higher frequencies.
News from Laird Technologies, Apr 25, 2006
Coating and cleaning in focus at Nepcon
Concoat personnel will be available on Stand K77 at Nepcon UK to discuss significant advancements in both UV curable conformal coating materials and circuit board cleaning media.
News from Concoat, Apr 25, 2006
Custom alloy cuts cost of Pb-free soldering
As the lead-free deadline approaches, Cookson Electronics is reporting spectacular growth in sales of Alpha Vaculoy SACX across Europe.
News from Cookson Electronics, Apr 24, 2006
Diamond disks are greener way to polish wafers
Diamond pad conditioner consumables for the semiconductor wafer polishing industry are claimed to be the first to offer environmental friendliness.
News from Advanced Diamond Solutions, Apr 24, 2006
CAM system adds mechanical CAD module
Aegis Europe will exhibit its new mechanical CAD module (MCAD) for CircuitCAM at Nepcon 2006.
News from Aegis Europe, Apr 24, 2006
Lithography systems sales continue upwards
ASML Holding has announced its 2006 first quarter results, recording net sales valued at Eur 629 million.
News from ASML, Apr 21, 2006
Reliability in focus at Boston show
Indium Corporation will highlight its reliability programme at Nepcon East/Electro on 10th and 11th May 2006 in Boston.
News from Indium Corporation of America, Apr 21, 2006
Slotless gaskets promise top shielding performance
New slotless beryllium copper EMI/RFI shielding strips are designed to offer improved shielding and ultimate strength.
News from TBA Electro Conductive Products, Apr 21, 2006
IEEE award for soldering expert Lee
Dr Ning-Cheng Lee has been chosen to receive the 2006 Exceptional Technical Achievement Award IEEE Components, Packaging and Manufacturing Technology Society.
News from Indium Corporation of America, Apr 20, 2006
No-flow underfill stars in Shanghai
NF260 no-flow underfill has been awarded the 2006 EM Asia Innovation Award at Nepcon Shanghai, China.
News from Indium Corporation of America, Apr 18, 2006
Patent infringement claims settled
Rogers Corp has settled its patent infringement claims against Isola USA Corp, Isola Laminate Systems Corp and Isola.
News from Rogers Corp, Apr 18, 2006
Underfill technologies explained at symposium
Materials expert Dr Brian Toleno will speak at the upcoming IMAPS Symposium on 26th April 2006 at the European Crystal Conference Centre in Algonquin Heights, Illinois.
News from Henkel Loctite Adhesives, Apr 18, 2006
Die bonder to enable microphone expansion
Alphasem's semiconductor technology has been evaluated by Knowles for its leading edge manufacturing process of semiconductor microphones.
News from Alphasem, Apr 14, 2006
Device packager has smaller components taped
The popular V-Tek TM-4450 is now available with support for taping of small devices including SOT23, 0805 and 0603 packages.
News from Adaptsys, Apr 14, 2006
High fill/flow bondply set for microwave symposium
The new RO4450B-dx bondply is a high fill/flow version of the industry standard RO4450B high frequency circuit material.
News from Rogers Corp, Apr 12, 2006
Tooling system provides uniform support
Photo Stencil is now the exclusive North American distributor for Novatec's underboard support product, VacuNest.
News from Photo Stencil, Apr 12, 2006
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