Product category: Electronics Manufacturing Machinery and Materials
News Release from: GE Plastics | Subject: PolarTherm XLR
Edited by the Electronicstalk Editorial Team on 12 October 2005
Boron nitride fillers
aid thermal management
A major challenge facing electronics manufacturers in moving to smaller and faster devices is effective heat dissipation from semiconductors
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High temperatures in semiconductors can reduce the performance of computers and other electronic devices. GE Advanced Materials has developed PolarTherm XLR boron nitride fillers to help overcome these challenges. GE's PolarTherm XLR materials are spherical agglomerates of boron nitride crystals which, when loaded into a polymer, can deliver up to two times the thermal conductivity of other boron nitride fillers.
GE's PolarTherm XLR spherical boron nitride differs from standard boron nitride fillers in the robust, isotropic nature of the agglomerate.
This results in a filler which is much less sensitive to processing, resulting in less particle breakdown and a more consistent thermal path for conducting heat from a source, such as a semiconductor, to a sink.
This helps thermal interface material producers to significantly reduce the thermal resistance of their products and deliver advanced solutions for demanding electronics applications.
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Speciality compound withstands lead-free reflow
When Winchester Electronics began developing a complete line of RoHS-compliant products it found the plastics it had traditionally used could not handle lead-free reflow
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PolarTherm XLR spherical boron nitride still delivers the trusted performance of boron nitride in critical applications including direct die contact, due to low ionic impurities, high dielectric strength and minimal stresses on sensitive components through a low coefficient of expansion and modulus.
The lubricious nature of boron nitride is maintained, making it easy on blending and other processing equipment.
The low density of GE's PolarTherm XLR spherical boron nitride also provides advantages by delivering these results at a lower loading level than competitive fillers such as alumina or silver.
PolarTherm XLR spherical boron nitride is currently available from GE in two grades.
PTX25 is a 25-micron mean-particle size grade, and PTX60 has a mean particle size of 60um.
These materials are aimed at premium thermal interface applications.
'GE's new PolarTherm XLR isotropic fillers address one of the most difficult challenges facing chip manufacturers - how to keep pace with the increasing heat generated by smaller and faster semiconductors', said Greg Strosaker, Industry Manager, Electronic Materials, GE Advanced Materials.
'Better heat dissipation plus high particle strength provided by GE's PolarTherm materials offer the industry greater design flexibility and an important competitive advantage'.
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