Indium Corporation's Vice President of Technology, Dr Ning-Cheng Lee, is featured on the cover of the latest issue of Electronics Manufacturing China.

News from Indium Corporation of America, Aug 23, 2005

High-tech circuit materials on show

Rogers will showcase its R/flex 3000 family of liquid crystalline polymer based circuit materials and RO4000 series high frequency circuit materials at DesignCon East in Worcester Massachusetts.

News from Rogers Corp, Aug 22, 2005

Collins identifies customer needs

Kevin Collins has joined the Indium Corporation Inside Sales Department as the Global Account Specialist.

News from Indium Corporation of America, Aug 18, 2005

New facility produces state-of-the-art stencils

MicroStencil has opened a new production facility for the manufacture of ultra-fine-pitch screen printing stencils.

News from MicroStencil Ltd, Aug 15, 2005

High frequency circuit materials on show

Rogers will be showing its high frequency circuit materials for use in commercial applications at this year's Antenna Systems Show on 22nd and 23rd September 2005 in Santa Clara, California.

News from Rogers Corp, Aug 15, 2005

Antistatic coatings cover any surface

The ACL Staticide range of antistatic products meet the static decay performance criteria outlined by the EIA541 and MIL-B-81705 specifications.

News from Electrolube, Aug 12, 2005

Usyk keeps network running

Gary Usyk has joined the information technology staff at Indium Corporation as the Network Administrator.

News from Indium Corporation of America, Aug 12, 2005

McKerrow specialises in metals and chemicals

Anne McKerrow has been promoted to Senior Specialist for Metals and Chemicals at Indium Corp.

News from Indium Corporation of America, Aug 10, 2005

Phipps takes charge of marketing

Indium Corporation has hired Greg Phipps as the Vice President of Marketing.

News from Indium Corporation of America, Aug 5, 2005

Todd to manage multiple technical teams

Henkel has appointed Dr Michael Todd to the position of Technical Director of Research, Development and Engineering for Material Sets.

News from Henkel, Aug 2, 2005

Flip-chip underfill is easy to work with

A new advanced material specifically designed as an underfill for flip-chip devices provides superior flow and more robust processing capability compared with competing products.

News from Henkel, Aug 1, 2005

Stencil is innovation of the year

Capillex CX has been awarded the Product Innovation of the Year Award at this year's Speciality Graphic Imaging Association Membrane Switch Symposium.

News from Autotype, Aug 1, 2005

Quick cure for nonconductive die attach adhesive

Hysol QMI538NB is the latest in a series of new die attach products from Henkel.

News from Henkel, Jul 29, 2005

Lusher covers northwestern states

Indium Corp has signed up Lusher Electronic Technology Sales (LETS) NW as its latest representative, responsible for sales and service in the Northwest USA.

News from Indium Corporation of America, Jul 28, 2005

Effective Pb-free training in Philadelphia

Indium Corp and the American Competitiveness Institute have teamed up once again to present what they reckon is the most effective Pb-free training programme available worldwide.

News from Indium Corporation of America, Jul 26, 2005

Research centre focuses materials expertise

Henkel has relocated its mould compound development, application engineering and technical service capabilities from Olean, New York, to its new Irvine research and applications centre.

News from Henkel, Jul 25, 2005

Read all about big savings on assembly kit

Surface mount specialist Alternative SMT has published a brand new European parts and services catalogue.

News from Alternative SMT, Jul 21, 2005

Novel HD media double storage density

The world's first commercial perpendicular-magnetic-recording-technology-based hard disk (HD) media enable a dramatic increase in media recording density.

News from SDK, Jul 20, 2005

CTS signs up for traceable manufacturing

CTS Electronics Manufacturing Solutions is to use Aegis NPI, MES, Analytical and CAMX data acquisition systems to meet the traceability requirements of the medical device manufacturing industry.

News from Aegis Europe, Jul 19, 2005

Seminar series kicks off at Oxford and Cambridge

The Electronics Group of Henkel has successfully supported two seminars on the implications of the forthcoming RoHS and WEEE Directives for the electronics industry.

News from Henkel, Jul 14, 2005

Conductive adhesive suits leadframe attachment

Hysol QMI168 is a silver filled conductive adhesive designed specifically for attachment of integrated circuits to metallic leadframes.

News from Henkel, Jul 11, 2005

Die attach paste survives thermal cycling

Hysol QMI600 die attach paste provides a low coefficient of thermal expansion and high modulus to match existing mould compound properties.

News from Henkel, Jul 8, 2005

Lead-free expertise shown off in the Netherlands

The Electronics Group of Henkel successfully exhibited its lead-free expertise at the recent technology days held at the European headquarters of Vitronic-Soltec.

News from Henkel, Jul 4, 2005

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Technique splices optical fibres in communications

Lightcrimp splice technology is a new rapid technique for splicing optical fibres in communications networks.
DEK stencil wipe reduces cleaning frequency

DEK introduces a stencil coating technology, the Nano-Protek wipe, which is designed to increase cleaning effectiveness and reduce cleaning frequency as it renders the stencil surface 'fluxophobic'.

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