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Electronics manufacturing materials

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Electronics manufacturing materials

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Showing 1001-1014 of 1014 articles

Greener chemicals are nonflammable as well

New and improved formulations of Techspray's environmentally safe HFE cleaner/degreaser, HFE flux remover and HFE contact cleaner are available from Intertronics.

News from Intertronics, Apr 23, 2001

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UV curing adhesives bond to 3000psi

According to UK distributor Intertronics, Dymax Series 800 adhesives form bonds to 3000psi on metal, ferrite, ceramic and glass surfaces.

News from Intertronics, Apr 19, 2001

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Enhanced squeegee technology aids solder printing

Tecan Stencils Limited (TSL) offers SMT board assemblers the most consistent performance possible from existing printing machines, using enhanced squeegee technology.

News from Tecan Components, Apr 19, 2001

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Electroformed wafer-bumping stencils

Electroformed wafer-bumping stencils from Tecan Stencils Limited (TSL) are used to accurately deposit solder paste directly onto silicon wafer die.

News from Tecan Components, Mar 12, 2001

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Tighter tolerances for nickel evaporation masks

Tecan has developed a range of high-performance nickel evaporation masks, for use in a range of selective vacuum chamber deposition processes, such as gold and silver plating on silicon.

News from Tecan Components, Feb 2, 2001

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Catalogue lists pre-owned SM production kit

A new catalogue containing details of a wide range of pre-owned equipment for surface-mount electronic production has been produced by alternativeSMT.

News from alternativeSMT, Jan 26, 2001

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Second-user production equipment on the web

AlternativeSMT, the leading European specialist in buying and selling pre-owned electronic assembly SMT equipment and feeders, has launched a comprehensive website.

News from alternativeSMT, Jan 5, 2001

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Novec fluids clean Swiss watches

Two leading names in the Swiss watch industry have recently replaced their old cleaning processes, to adopt a faster and more efficient system featuring Novec Engineered Fluids, from 3M.

News from 3M Speciality Materials, Jan 2, 2001

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Labyrinth RFI screening can brings RFI benefits

A labyrinth RFI screening can is an effective one-part board-level alternative for PCB designs which would otherwise require solid metal enclosures or multiple screening cans.

News from Tecan Components, Jan 2, 2001

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Mini rework stencils save time and money

Mini stencils from Tecan Stencils ensure accurate repeatable paste deposits are produced when replacing components such as QFPs, PLCCs and BGAs during PCB rework operations.

News from Tecan Components, Jan 2, 2001

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Cost-effective swab for the electronics industry

At Helapet we are very pleased to announce the introduction of the Coventry 44070 sealed foam swab, a very superior cost-effective swab for the Electronics and Disk Drive industries.

News from Helapet, Nov 6, 2000

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Can-on-board solder migration problems solved

Tecan Components has solved a range of problems associated with automated soldering of RFI screening cans/fences onto PCBs with the introduction of the 'Plimsoll line and lattice bridging stencils'.

News from Tecan Components, Oct 24, 2000

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More economic PCB stacking trays

Vacuum forming techniques by Toolcraft Plastics of Swindon on a new range of trays for stacking PCBs gives added benefits of economy and clean edges.

News from Toolcraft Plastics (Swindon), Sep 21, 2000

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Anodic bonding joins silicon wafers to glass

AML launches its first, new, standalone, flexible, "off-the-shelf" Anodic Bonding machine the AML-400.

News from Applied Microengineering, Mar 27, 2000

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