Electronics manufacturing materials
(a sub category of Electronics manufacturing, packaging)
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Electronics manufacturing materials
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ASML completes Brion Technologies acquisition
Brion's products and technology will complement and reinforce ASML's core lithography business.
News from ASML, Mar 9, 2007
Lead-free alloy saves on silver
Modified tin copper alloy offers outstanding performance without any silver content, making it an economical alternative to lead-free solders containing 3-4% silver.
News from Debens, Mar 8, 2007
Wave soldering flux answers lead-free demands
High-temperature no-clean wave soldering flux solves wetting problems in lead-free wavesoldering.
News from Parkheath, Mar 8, 2007
Resin system goes well beyond the RoHS Directive
Polyurethane resin specialist ALH Systems has developed a two-part resin system it reckons is the safest in the industry.
News from ALH Systems, Mar 5, 2007
SMT stencils on show around the USA
Photo Stencil will be present at four upcoming Surface Mount Technology Association (SMTA) shows.
News from Photo Stencil, Mar 1, 2007
Half a century of conformal coatings
HumiSeal reckons it is the only vendor able to manufacture and supply conformal coatings solutions from all of the main types of chemistry.
News from HumiSeal Europe, Feb 28, 2007
Silver-filled epoxy conducts heat and current
Araldite 7047 epoxy adhesive is a high purity, 100% solids system designed for void-free bonding of circuitry and microelectronic chips to printed circuit boards.
News from Huntsman Advanced Materials, Feb 27, 2007
Conference illustrates life below 45nm
Imaging results for immersion and extreme ultraviolet technologies will be presented during SPIE Microlithography 2007.
News from ASML, Feb 27, 2007
Joint venture starts on TFT-LCD glass substrates
Kuramoto and Schott have officially opened their new joint venture for the processing of large format TFT-LCD glass substrates in Korea.
News from Schott, Feb 26, 2007
Materials centre progresses on schedule
Construction work is progressing as scheduled on a new integrated production plant for process chemicals for the semiconductor industry.
News from BASF, Feb 19, 2007
Alliance brings strippers and cleaners to Europe
Dynaloy and BASF have entered into an expanded sales and distribution agreement for strippers and cleaners used in the IC industry for wafer level packaging and bumping steps.
News from BASF, Feb 16, 2007
Work begins on gas plant
Air Products has broken ground on the first phase of its nitrogen trifluoride (NF3) plant in Ulsan, Korea.
News from Air Products, Feb 15, 2007
Labels demonstrate China RoHS compliance
China RoHS labels come in seven different styles including six standard formats with commonly requested environmentally friendly use period (EFUP) numbers.
News from LGInternational, Feb 14, 2007
Shielding and screening line is exclusive
EMI and RF shielding and screening specialist P and P Technology has appointed Aerco as its sole UK distributor.
News from Aerco, Feb 8, 2007
Alignment pin for rack-mounted telecoms systems
A newly developed PEM self-clinching alignment pin enables easy mating of faceplates in telecom rack system applications.
News from PennEngineering, Feb 5, 2007
Boudre to engineer substrate expansion
Soitec has appointed former KLA-Tencor executive, Paul Boudre, to the newly created post of Executive Vice President of Sales, Marketing and Customer Support.
News from Soitec, Feb 5, 2007
Stacking technology saves space and power
AMI Semiconductor is in full production mode with AIT's stacked die quad flat package no leads module for various consumer electronics applications.
News from Advanced Interconnect Technologies, Jan 31, 2007
Lead-free intrusive reflow to be explained
Photo Stencil will present a paper and exhibit at the upcoming IPC Printed Circuits Expo, APEX and Designers Summit.
News from Photo Stencil, Jan 31, 2007
Finishes adapt components' surface properties
Gold-based finishes are designed to provide optimum durability, reliability and/or solderabiilty dependent on the application.
News from Tecan, Jan 23, 2007
Adhesives focus for exhibition stand
Intertronics reckons that Stand D37 at the Southern Manufacturing Show at Thorpe Park on 7th and 8th February is the place to go for anyone who specifies or uses adhesives.
News from Intertronics, Jan 23, 2007
Chinese plant to expand PCB materials production
Huntsman Corp has expanded production capacity for its printed circuit board materials by investing in new production facilities at its site in Panyu, China.
News from Huntsman Advanced Materials, Jan 18, 2007
Distributor expands Mexican coverage
Indium Corp has expanded its sales efforts into Sonora, Mexico with the addition of Multi Dicona as its newest distributor.
News from Indium Corporation of America, Jan 18, 2007
High-speed imaging accelerates solder checks
Solder paste inspection system is claimed to enable manufacturers of printed circuit board assemblies to slash inspection time in half, without compromising capability.
News from Agilent Technologies Europe, Jan 18, 2007
ASML outgrows lithography equipment market
ASML Holding has announced 2006 annual and fourth quarter results, with a 42% increase in sales over the previous year.
News from ASML, Jan 18, 2007
Aerosols clean up on PCB assemblies
3M Novec Engineered Fluids for contact cleaning, degreasing and flux removal are now available in convenient aerosol canisters.
News from 3M Electronic Materials, Jan 16, 2007
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