Electronics manufacturing materials
(a sub category of Electronics manufacturing, packaging)
Add this sub-category to My Alerts
Electronics manufacturing materials
A - Z list of suppliers
Click on a letter below to find a supplier...
Latest articles from 'Electronics manufacturing materials'
News releases from this sub-category
Showing 51-75 of 1014 articles
- first
- 1
- 2
- 3
- 4
- 5
- 6
- 7
- 8
- 9
- 10
- 11
- 12
- 13
- 14
- 15
- 16
- 17
- 18
- 19
- 20
- 21
- 22
- 23
- 24
- 25
- 26
- 27
- 28
- 29
- 30
- 31
- 32
- 33
- 34
- 35
- 36
- 37
- 38
- 39
- 40
- next
Intertronics offers fast cure encapsulants
Intertronics is offering the Dymax Multi-Cure 9001-E Series of electronic encapsulants.
News from Intertronics, Nov 26, 2009
Cyanoacrylate adhesives bond dissimilar materials
Permabond cyanoacrylate adhesives can be used for joining dissimilar and hard-to-bond materials, quick curing with very strong adhesion and a range of viscosities.
News from Permabond, Nov 26, 2009
Permabond epoxies bond to variety of materials
Available with a range of cure speeds, Permabond epoxies have been developed to offer a high standard of performance for demanding bonding applications.
News from Permabond, Nov 26, 2009
Electrolube DCA-FD suits harsh environments
Electrolube has exhibited the DCA-FD - a modified silicone conformal coating that is touch-dry in 20 minutes - at Productronica.
News from Electrolube, Nov 23, 2009
Essemtec to distribute component-storage system
Essemtec will receive the worldwide distribution rights for the Tower, an SMD component-storage system, in 2010.
News from Essemtec, Nov 10, 2009
Intertronics encapsulant suits LED equipment
Intertronics has launched its Opti-tec 4200 encapsulant/potting compound and adhesive.
News from Intertronics, Nov 9, 2009
Lynx hybrids function as combiners or dividers
Link Microtek has added a range of general-purpose 90deg hybrid devices to its Lynx portfolio of microwave components.
News from Link Microtek, Nov 4, 2009
PTFE technology applied to hydrophobic filters
Gore and Associates has applied its PTFE technology to a range of hydrophobic filters for the manufacture of bulk high-purity chemicals used in semiconductor and electronics fabrication.
News from Gore and Associates, Nov 3, 2009
Rogers improves toughness of Poron materials
Rogers Corporation has announced a recent improvement to the Poron Soft Seal Series in the form of enhanced surface toughness.
News from Rogers Corp, Oct 12, 2009
Dymax adhesives utilise Ultra-Red fluorescing
Intertronics has announced that the Ultra-Red fluorescing technology built into many Dymax adhesives offers assemblers concrete advantages in plastics fabrication.
News from Intertronics, Oct 9, 2009
Rochester extends life of discontinued products
Rochester Electronics provides manufacturing and customer support for semiconductor products that are being discontinued by the original manufacturer.
News from Rochester Electronics, Oct 6, 2009
Farnell offers environmentally friendly packing
Farnell is offering Antistat's environmentally friendly packaging solution for the electronics industry.
News from Farnell, Oct 2, 2009
Oracle lists more than 5,000 approved suppliers
Oracle Components, an independent distributor, has developed a list of more than 5,000 approved and listed suppliers for buyers to access.
News from Oracle Components, Oct 1, 2009
Defluxing cleaning agent is sensitive
Zestron will introduce a defluxing cleaning agent, Vigon N 501, at this year's Productronica trade show (Hall A 2, booth 461).
News from Zestron Europe, Sep 21, 2009
Adjustable Rail Cart simplifies bulk-item storage
Bliss Industries has unveiled an Adjustable Rail Cart that can be used for bulk item storage.
News from Bliss Industries, Sep 21, 2009
MG 100 standalone unit uses Filtronic filter
Link Hamson has introduced the MG 100 Kit Mobile Filter System, presenting Filtronic filter technology in a cost-effective, standalone unit.
News from Link Hamson, Sep 18, 2009
BASF LTP process metallises solar cells
BASF and Schmid have jointly developed a contact-free, laser-transfer printing (LTP) process for metallising the front and back of solar cells.
News from BASF, Sep 18, 2009
ACM laminates feature low dissipation factor
The Advanced Circuit Materials (ACM) Division of Rogers Corporation has introduced RO4360 laminates, developed for the special requirements of high-frequency amplifier designers.
News from Rogers Corp, Sep 15, 2009
Component packaging is environmentally friendly
Farnell has launched biodegradable, static dissipative bags that are said to provide an environmentally friendly packaging solution for electronics.
News from Farnell, Sep 10, 2009
Cookson launches alcohol-based flux
Cookson Electronics Assembly Materials is introducing its Alpha EF-6103 alcohol-based flux designed to optimise solderability and reliability.
News from Cookson Electronics, Sep 3, 2009
Bisco A2 blocks sound and cuts low-frequency noise
Rogers' High Performance Foams (HPF) Division has introduced an acoustic sound-barrier material for demanding aircraft applications.
News from Rogers Corp, Aug 31, 2009
ACC silicone adhesives are non-corrosive
ACC Silicones, a manufacturer of silicone adhesives, has developed two technically advanced products that meet the standards laid down by the Mil-A-46146B specification.
News from ACC Silicones, Aug 27, 2009
Green Monster withstands wiping abrasion
High-Tech Conversions has announced that its Green Monster formulation has the abrasion resistance to withstand the high friction caused by the wiping action.
News from High-Tech Conversions, Aug 24, 2009
RO4730 Lopro laminates extend drill-tool lives
Rogers, a supplier of high-frequency laminates, will showcase its RO4730 Lopro antenna-grade laminates at the Antenna Systems Conference, to be held 1-2 September in Philadelphia.
News from Rogers Corp, Aug 14, 2009
DEK upgrades Direkt wafer coating
DEK has enhanced the process capability of its Direkt Coat technology by a factor of three.
News from DEK, Aug 12, 2009
Showing 51-75 of 1014 articles
Add this sub-category to My Alerts
Electronics manufacturing materials
Not what you're looking for? Search the site.
Featured articles
- Technique splices optical fibres in communications
Lightcrimp splice technology is a new rapid technique for splicing optical fibres in communications networks. - DEK stencil wipe reduces cleaning frequency
DEK introduces a stencil coating technology, the Nano-Protek wipe, which is designed to increase cleaning effectiveness and reduce cleaning frequency as it renders the stencil surface 'fluxophobic'.
Browse by category
- Active components (13484)
- Passive components (3570)
- Design and development (10238)
- Enclosures and panel products (3950)
- Interconnection (3604)
- Electronics manufacturing, packaging (3477)
- Industry news (2104)
- Optoelectronics (1952)
- Power supplies (2978)
- Subassemblies (5602)
- Test and measurement (5768)
