A manufacturing equipment maker is to establish a centre of excellence near Taipei to focus on technology and applications development, equipment support, training, logistics, and refurbishment.

News from ASML, Apr 9, 2007

Solder pastes suffer from tin and silver rises

Indium Corporation has placed a surcharge on its silver- and tin-containing solder paste products, effective immediately.

News from Indium Corporation of America, Apr 6, 2007

Adhesives encapsulate, insulate and bond

A comprehensive series of high-strength epoxy and polyurethane adhesives provides encapsulation, insulation and bonding of electronic components and PCBs.

News from Huntsman Advanced Materials, Apr 3, 2007

Sales rep covers northeastern states

Indium Corp has appointed LFG Micro as a sales representative in the Northeast USA, covering New Jersey, Eastern Pennsylvania and Southeastern New York State.

News from Indium Corporation of America, Apr 2, 2007

Tin market boom puts surcharge on solder

Cookson Electronics Assembly Materials has placed a surcharge on its Alpha brand tin-bearing solder pastes, effective 30 days from customer notification.

News from Cookson Electronics, Apr 2, 2007

Scholarship fund honours retiring chairman

A scholarship fund set up as a tribute to Henk Bodt, retiring Chairman of the ASML Supervisory Board, funds up to 40 master's degree students per year.

News from ASML, Apr 2, 2007

Staff changes support product marketing

Indium Corp has promoted Seth Homer to Product Support Specialist for Engineered Materials and hired Rui "Anny" Zhang as Product Specialist for Solder Paste Products.

News from Indium Corporation of America, Mar 29, 2007

Laser-structurable polyamide makes 3D circuits

Kromberg and Schubert has developed the first 3D-MID electronic components made of BASF's new laser-structurable polyamide.

News from BASF, Mar 26, 2007

Double-sided tape eases electronics assembly

Thin double-coated film features a sturdy, high-shear strength and low profile for a variety of electronics applications.

News from M+C Specialties, Mar 26, 2007

Sealant shields and resists corrosion

Material is ideal for use between aluminium surfaces on outdoor enclosures where environmental sealing, plus EMI shielding and resistance to galvanic corrosion are required.

News from Chomerics Europe, Mar 26, 2007

Distributor supports Arizona manufacturers

KTEC Equipment and Supplies will distribute solder pastes, rework fluxes, wave fluxes, flux-cored wire, solder bar, solid wire, and tape and reel solder preforms throughout Arizona.

News from Indium Corporation of America, Mar 23, 2007

High-k materials enable IC advances

Recent advances by major semiconductor manufacturers to develop 45nm semiconductor chips have been made possible through the use of high-k materials in the gate dielectric.

News from Air Products, Mar 22, 2007

Manufacturing software set for upgrade at Nepcon

Aegis Industrial Software will showcase the Version 7 evolution of its proven NPI and MES software system on Stand L28 at Nepcon 2007 in Birmingham, UK.

News from Aegis Europe, Mar 21, 2007

Adhesive answers Chinese electronics demands

First controlled-volatility thermally conductive adhesive designed and developed specifically for customers in China and Taiwan.

News from Dow Corning, Mar 21, 2007

Ceramic processes explained by product guide

AdTech Ceramics, specialising in advanced technical ceramic solutions in a wide variety of materials, has published a new design and capabilities guide.

News from AdTech Ceramics, Mar 21, 2007

Electronic materials on show in Shanghai

Huntsman Electronics has supported International Electronic Circuits Exhibition in Shanghai since 1999, and this year is presenting a range of advanced products.

News from Huntsman Advanced Materials, Mar 20, 2007

Troubleshooting and reliability in focus

Lecture on lead-free electronics assembly at the SMT/Hybrid/Packaging Conference in Nuremberg, Germany, will emphasise troubleshooting and finished goods reliability.

News from Indium Corporation of America, Mar 19, 2007

Shielding gaskets are RoHS compliant

Range of beryllium copper fingerstock gaskets for EMI shielding meets the Restriction of Hazardous Substances Directive 2002/95/EC.

News from TBA Electro Conductive Products, Mar 19, 2007

Hard-coated polyester film for cell phone screens

A hardcoated polyester film has been specially designed to offer excellent levels of clarity and scratch resistance for the displays of communications devices such as mobile phones.

News from MacDermid Autotype, Mar 19, 2007

Leading-edge solder technologies at Nepcon

Almit Technology will showcase a range of leading-edge solder technologies at this year's Nepcon exhibition, being held at the Birmingham NEC from 15th to 17th May.

News from Almit Technology, Mar 15, 2007

Adhesive films and preforms set for Nepcon launch

Ellsworth Adhesives has confirmed plans to launch its new Techfilm product range at Nepcon 2007, where it will also showcase a range of established technologies.

News from Ellsworth Adhesives, Mar 13, 2007

Multilayered film keeps LCDs safe from damage

Removable film helps protect LCDs from scuffs, scratches and fingerprint damage.

News from 3M Digital Signage, Mar 13, 2007

Cored wire solder is lead free

Synthetic polymer technology cored wire solder delivers excellent wetting, bright solder joints and clear, noncorrosive residues.

News from Parkheath, Mar 9, 2007

Showing 301-325 of 1014 articles

first
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
next

Add this sub-category to My Alerts

Electronics manufacturing materials

What is this?

Not what you're looking for? Search the site.

Technique splices optical fibres in communications

Lightcrimp splice technology is a new rapid technique for splicing optical fibres in communications networks.
DEK stencil wipe reduces cleaning frequency

DEK introduces a stencil coating technology, the Nano-Protek wipe, which is designed to increase cleaning effectiveness and reduce cleaning frequency as it renders the stencil surface 'fluxophobic'.

Request your free weekly copy of the Electronicstalk email newsletter ...

Electronicstalk

Electronics manufacturing materials

(a sub category of Electronics manufacturing, packaging)

A - Z list of suppliers

Click on a letter below to find a supplier...

Latest articles from 'Electronics manufacturing materials'

News releases from this sub-category

Showing 301-325 of 1014 articles

Bioplastic composite to make heatsinking packages

Polyurethane resins go under the bonnet

Manufacturing centre of excellence for Taipei