Electronics manufacturing materials
(a sub category of Electronics manufacturing, packaging)
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Electronics manufacturing materials
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Multilevel stencils minimise post-print rework
Tecan is ramping up production of its multilevel stencils to meet increasing demand from PCB builders.
News from Tecan, Oct 3, 2005
Printed electronics projects show promise
BASF Future Business is working on leading edge printed electronics technology based on organic semiconductors that can be used in a broad variety of everyday applications.
News from BASF, Sep 29, 2005
Company claims rising star award
CrystalQ has won this year's Rising Star award in the Deloitte Technology Fast 50 competition.
News from CrystalQ, Sep 29, 2005
Latest lead-free soldering materials go on display
Cookson Electronics Assembly Materials will show its complete line of Alpha lead-free soldering materials on stand 262 in Hall 4 at Productronica 2005, including soldering alloys, fluxes and pastes.
News from Cookson Electronics, Sep 27, 2005
Appointments improve customer service resources
Indium has improved customer service resources in Malaysia, India and the Philippines by promoting Sehar Samiappan to Senior Technical Engineer, and by hiring David Vetharudge as Area Sales Manager.
News from Indium Corporation of America, Sep 27, 2005
Lead-free adhesives go on show at Productronica
With a new sense of urgency fuelling the global transition to lead-free, the electronics group of Henkel is using Productronica 2005 to exhibit its comprehensive lead-free product range.
News from Henkel Loctite Adhesives, Sep 26, 2005
Novel alloy claims top lead-free performance
A new wave-soldering alloy is claimed to outperform the standard lead free solder bars currently available and so ease the trauma of transition to lead-free assembly.
News from Cookson Electronics, Sep 19, 2005
Wipes set to clean up stencil operations
Bioact SC-10 wipes are tough, long lasting lint free cloths, saturated in a mixture of organic solvents designed specially for nonaqueous cleaning operations.
News from Cookson Electronics, Sep 19, 2005
Solder preforms work with pick and place lines
Tape and reel packaged solder preforms allow measured amounts of solder to be deposited accurately, selectively and without special equipment.
News from Cookson Electronics, Sep 19, 2005
New distributor for France
Indium Corporation of America has signed up Chimie Tech Services as its latest distributor in Europe.
News from Indium Corporation of America, Sep 19, 2005
Brown turns to flux chemistry
After 3 successful years as Regional Marketing Manager with Cookson Electronics Assembly Materials, Steve Brown is moving into the role of Global Product Manager - Flux Chemistry.
News from Cookson Electronics, Sep 16, 2005
Solder waste requires special procedures
Cookson Electronics is the UK's largest solder reclaim operation and is highly experienced in the reprocessing of solder dross, paste etc, including meeting all legal and environmental obligations.
News from Cookson Electronics, Sep 16, 2005
Lead-free range aims for wider process window
Cookson Electronics has focused on developing products with a greater process tolerance than previous generations of lead-free solder paste, wave solder flux, cored wire and wave solder bar.
News from Cookson Electronics, Sep 15, 2005
Stencils claim exceptional paste volume control
Alphaform electroformed stencils are designed for ultra-fine-pitch tolerances in surface mount and microelectronics applications, and for high volume assemblers.
News from Cookson Electronics, Sep 15, 2005
Heat shrink grommets suit military connectors
Raychem brand Shrinkhoop URHR cable clamp heat shrink grommets allow for ultrahigh shrink ratios up to 10:1.
News from Tyco Electronics UK, Sep 15, 2005
Low cost alternative to chrome plated masks
Microstencil can now offer users of photomasks and photoplotted polyester films a "low cost" alternative to the more commonly used chrome plated masks.
News from MicroStencil, Sep 15, 2005
Full lead-free range goes on show
Indium Corporation will be exhibiting its Pb-free suite of materials at the Assembly Technology Expo in Rosemont, Illinois, from 26th to 28th September 2005.
News from Indium Corporation of America, Sep 12, 2005
Showcase for high-performance foams
Rogers Corp and Rogers Inoac Corp will be showcasing Poron, Bisco and NanNex high performance foams for electronic and automotive applications at this year's eMEX.
News from Rogers Corp, Sep 12, 2005
Solder paste eases process transition
Halide-free no-clean Multicore MP218 solder paste is now optimised to enable modern Sn-Pb processes, allowing for the inevitable interaction with lead-free device finishes.
News from Henkel, Sep 9, 2005
Promotion for Cusano
Luigi Cusano has been promoted to the position of Plant Manager for the Henkel City of Industry Facility.
News from Henkel, Sep 7, 2005
Japanese experience aids European Pb-free switch
Almit Technology will show its extensive range of advanced lead-free solder materials and chemicals at Productronica 2005.
News from Almit Technology, Sep 5, 2005
Applications engineering team expands
Indium Corporation has appointed three new applications engineers.
News from Indium Corporation of America, Sep 5, 2005
Lead-free paste proves popular
BLT Circuit Services reports that to date 48 machines in the UK have been converted to use its nonpatented SACP0307 lead free solder paste.
News from BLT Circuit Services, Sep 5, 2005
If the volume control fits - wear it!
Unveiled this week by Scottevest, the SeV Tactical VC jacket incorporates ElekTex, Eleksen's groundbreaking intelligent and interactive fabric.
News from Eleksen, Aug 26, 2005
Monomer promises faster photosetting
SDK has developed a new grade of high-performance isocyanate monomer for precision surface treatment of liquid crystal displays (LCDs) and semiconductors.
News from SDK, Aug 25, 2005
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