Die bonder suits Swiss sensor startup

Alphasem has delivered one of its new Easyline 8088 die bonders to Swiss startup Sensirion.

Alphasem has delivered one of its new Easyline 8088 die bonders to Swiss startup Sensirion.

The Easyline 8088 was especially developed for sensor assembly.

"With Easyline 8088 we can provide the perfect tool for Sensirion", said Urs Hirsiger, Sales Manager at Alphasem.

Founded in 1998, Sensirion has developed a technique to manufacture sensors using standard CMOS technology, making them economical to produce.

Its chips are found in systems that measure heat, moisture, gas flow and liquid currents in a wide range of industrial applications, where accuracy is critical.

The Easyline 8088 is based on the field proven Easyline platform and features a high-speed air-bearing pick and place system, a closed-loop linear-motor pick tool for unbeaten bond line thickness control and a fully automatic wafer handling system.

To match MEMS and sensor related demands, an active and precise theta control of the bond head is implemented.

The modular approach of the Easyline 8088 ensures later upgradeability and ongoing flexibility to adapt to new technologies and changing production volumes.

This makes it ideal for Sensirion, which will use Easyline 8088 to process pilot series and small volumes.

The order gives a boost to Alphasem's position in the European market, said Hirsiger.

European manufacturers are unmatched in the fast growing sensor market.

Alphasem is now able to provide these manufacturers with ideal systems.

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