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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Cookson Electronics | Subject: XB3
Edited by the Electronicstalk Editorial Team on 10 November 2005

Next dimension in substrate and wafer
bumping

Cookson Electronics and EEJA announce the launch of XB3, the next dimension in substrate and wafer bumping technology that promises to bring vastly increased speed.

Cookson Electronics and EEJA announce the launch of XB3, the next dimension in substrate and wafer bumping technology that promises to bring vastly increased speed, resulting in higher throughput, and the flexibility to deposit complex alloys, including lead-free It can also handle a wide dynamic range of size and pitch