Electronics manufacturing materials
(a sub category of Electronics manufacturing, packaging)
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Electronics manufacturing materials
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Workshops examine stencil printing performance
A series of workshops during 2006 will provide information on stencil printing performance and how stencil technology and stencil design influences stencil printing performance.
News from Photo Stencil, Mar 14, 2006
New facilities expand Chinese support network
A customer applications lab in Guangzhou and a new office in Beijing join an existing facility in Shanghai to provide applications and technical support for all markets and regions in China.
News from Asymtek, Mar 13, 2006
Customer comments add up to award
Asymtek has been awarded a Circuits Assembly magazine Service Excellence Award for the third consecutive year.
News from Asymtek, Mar 13, 2006
Flipper accelerates conformal coating operations
The In-Cell Flipper is a novel productivity-enhancing option available for one- or two-sided selective conformal coating of circuit boards.
News from Asymtek, Mar 13, 2006
Silicones meet stringent industry standards
Durable and flame retardant, Bisco silicones meet the most stringent industry standards worldwide for flame, smoke and toxicity resistance.
News from Rogers Corp, Mar 13, 2006
Device packaging expertise on show in Scottsdale
Indium Corporation will exhibit on Booth 35 at the IMAPS International Conference and Exhibition on Device Packaging on from 20th to 23rd March 2006 in Scottsdale, Arizona.
News from Indium Corporation of America, Mar 10, 2006
Tiny hard disk finds handset home
SDK's 0.85in-diameter hard disk media, the smallest in the world, have been adopted by Toshiba Corporation in its latest mobile phone.
News from SDK, Mar 9, 2006
Thermally conductive adhesive in the showcase
Loctite 3876 was chosen to be part of the IPC's Innovative Technology Showcase at the recent APEX show in Anaheim.
News from Henkel Loctite Adhesives, Mar 9, 2006
Lead-free presentation to emphasise reliability
Indium Corporation's Vice President of Technology, Dr Ning-Cheng Lee, will emphasise reliability in a presentation to be delivered at the Intel Lead-Free Symposium in Scottsdale, Arizona.
News from Indium Corporation of America, Mar 8, 2006
Thermal reliability in the spotlight
Indium Corporation will present its thermal reliability technology programme at Semi-Therm in Dallas.
News from Indium Corporation of America, Mar 2, 2006
Solder pots deal with lead-free dross
New solder pots automatically create a dross-free zone for fast, reliable and efficient soldering with lead-free solders.
News from Solbraze, Mar 1, 2006
Water-soluble flux works with both processes
WF-1010 is a novel VOC-free water-soluble wave solder flux that is effective for use with both Sn/Pb and Pb-free assemblies.
News from Indium Corporation of America, Feb 27, 2006
Microlithography conference hears of advances
ASML Holding has presented its latest advances in leading-edge production technology as well as its research and development progress at SPIE Microlithography 2006 in San Jose, California.
News from ASML, Feb 23, 2006
Gap-filling material is easy to apply
Gap Filler 2000 is a high-performance thermally conductive electrically isolating liquid gap-filling material supplied as a two-component room or elevated temperature curing system.
News from Bergquist Company, Feb 22, 2006
Website focuses on "green" materials
Rogers Corp has set up a new "Green Leader" website, which contains information on Rogers' environmentally friendly specialty materials, and related subjects.
News from Rogers Corp, Feb 20, 2006
Reclamation specialist meets environmental mark
Precious metals reclamation specialist Phoenix County Metals has achieved accreditation to ISO14001 at the first attempt.
News from Phoenix County Metals, Feb 17, 2006
Nepcon stand to feature 14 demonstrations
Production automation specialist Contax will be exhibiting on stand D20 at Nepcon UK from 9th to 11th May 2006 at the NEC, Birmingham.
News from Contax, Feb 17, 2006
Underfill cures rapidly at low temperatures
Loctite 3549 is a high flow underfill formulated specifically for use with today's advanced CSP and BGA packages.
News from Henkel Loctite Adhesives, Feb 17, 2006
No-flow underfill wins award at APEX
NF260 No-Flow underfill won the 2006 Vision Award at the APEX show in Anaheim, California.
News from Indium Corporation of America, Feb 16, 2006
Novel wafer structure boosts heat dissipation
Available now from extreme materials developer Group4 Labs, is a revolutionary gallium nitride (GaN)-on-diamond semiconductor wafer.
News from Group4 Labs, Feb 15, 2006
Lead-free solder paste handles finer pitches
Multicore LF328 is a halide-free, no-clean, lead-free solder paste designed for high volume stencil printing applications with CSP lead pitches of 0.5 and 0.4mm.
News from Henkel Loctite Adhesives, Feb 15, 2006
Clips put a new barb on applying PCB screens
New technology can significantly cut the production time needed to solder large RFI screening cans and fences onto printed circuit boards
News from Tecan, Feb 13, 2006
Third-party study confirms stencil superiority
Photo Stencil has published the results of a comparison study between AMTX (Advanced Microfabrication Technology Xerox) E-Fab electroform and laser-cut electroform nickel foil.
News from Photo Stencil, Feb 8, 2006
Fischer to focus on lead-free in the Americas
Henkel Corporation's Electronics Group has appointed Dr Gordon Fischer to the position of Vice President of Sales, Marketing and Technical Service for the Americas.
News from Henkel Loctite Adhesives, Feb 6, 2006
Agile and Paratek settle dispute
Agile Materials and Technologies and Paratek Microwave have reached a settlement agreement on all litigation between the two parties.
News from Agile Materials and Technology, Feb 3, 2006
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