Die bonder turns to sensor assembly

A new machine is the first to offer die bond technology proven in high volume production at an attractive price/performance ratio for the sensor and micro assembly market.

New from Alphasem, the Easyline 8088 is a die bonder for sensor assembly.

Applications such as pressure sensors, accelerometers, gyroscopes and many more components in automotive, biomedical and IT markets can be efficiently processed using the new machine.

The new machine is the first to offer die bond technology proven in high volume production at an attractive price/performance ratio for the sensor and micro assembly market.

The equipment is based on the field proven Easyline platform and features many state-of-the-art technologies, such as the high-speed air bearing pick and place system, closed-loop linear motor pick tool for unbeaten bond line thickness control and the fully automatic wafer handling system.

To match MEMS and sensor related demands, an active and precise theta control of the bond head is implemented.

As the Easyline 8088 can handle all type of substrates like lead frames, premoulded lead frames and ceramics up to 4.5 x 4.5in it is the perfect tool for sensor related die bonding.

Alphasem's proven dispense technology allows exact dispensing of epoxies and solder pastes.

The unique closed-loop-controlled linear motor pick tool provides active control of the placement height, which results in a stable bond line thickness.

An "open interface" (SMEMA) allows fast adaptation to third party systems or integration into a production line.

Front access to all major systems simplifies operation - and all that within a footprint of only 1m2.

The modular approach ensures later upgradeability and ongoing flexibility to adapt to new technologies and the changing production loads.

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