Electronics Manufacturing Materials, Consumables

(a sub category of Electronics Manufacturing, Production, Packaging)

Latest articles from 'Electronics Manufacturing Materials, Consumables'

News releases from this sub-category

Showing 276-300 of 901 articles

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Lab to accelerate process chemical development

BASF has opened a new clean room laboratory in Ludwigshafen for the development of new process chemicals for the semiconductor industry and customer support in application technology in this market.

News from BASF, Oct 3, 2006

Pb-free solder paste cleans up award

Indium Corporation has been recognised with a Global Technology Award for its Indium5.1AT Pb-free solder paste.

News from Indium Corporation of America, Oct 2, 2006

Lee and Lasky to feature at lead-free workshop

Ning-Cheng Lee and Ronald C Lasky will present at "Implementing lead-free: a hands-on workshop", at the Rochester Institute of Technology this month.

News from Indium Corporation of America, Oct 2, 2006

Labels indicate RoHS compliance status

RoHS labels come in six different styles indicating RoHS compliance or noncompliance.

News from LGInternational, Oct 2, 2006

Guide explains WEEE Directive requirements

Simple guide helps producers and manufacturers of electrical and electronic equipment to understand their obligations and responsibilities with regards to the WEEE Directive.

News from Apache Electronics, Oct 2, 2006

Automated programmer speeds device throughput

The Helix desktop automated programmer offers a tray input and output handling system in addition to support for devices in tubes.

News from Adaptsys, Sep 26, 2006

Cable ties are among the most durable

Cable ties are intended for a range of uses in the home, office or industrial environment, and are ideal for any temporary securing need.

News from GC Electronics, Sep 26, 2006

Reliability in focus at Mexican show

Indium Corporation will feature its Reliability programme at Mexitronica, from 10th to 12th October 2006 in Guadalajara, Mexico.

News from Indium Corporation of America, Sep 26, 2006

Ceramic packages show up in Munich

Ceramic package specialist AdTech Ceramics will be represented on the Statek stand at Electronica 2006.

News from AdTech Ceramics, Sep 22, 2006

Brochure available

Lasky blog receives honorable mention

A blog compiled by Indium Corp's Dr Ronald C Lasky is mentioned in "The corporate blogging book" (Penguin Group, 2006), written by Debbie Weil.

News from Indium Corporation of America, Sep 22, 2006

Jet loan aids special athletes

Indium Corporation has participated in the Special Olympics Airlift, which provides transportation to over 1500 athletes from all over the country to the 2006 US National Games in Ames, Iowa, USA.

News from Indium Corporation of America, Sep 21, 2006

Hard disk media businesses unite

Showa Denko (SDK) is to merge its wholly owned subsidiary Showa Denko HD with a view to further strengthening its hard disk (HD) media business.

News from SDK, Sep 21, 2006

Sematech seeks out next-generation lithography

Sematech has awarded a contract to qualify the imaging performance of advanced logic patterns, metrology structures and defect designs for the 45, 32 and 22nm technology nodes.

News from ASML, Sep 20, 2006

Lab is base for organic electronics research

BASF has opened its Joint Innovation Lab in Ludwigshafen, where it will conduct collaborative research into new materials in the field of organic electronics.

News from BASF, Sep 19, 2006

Novel substrate makes OLEDs more flexible

GE Global Research has developed a novel substrate system for flexible, organic light-emitting diodes (OLEDs).

News from GE Plastics, Sep 14, 2006

Manufacturing information management on show

Aegis Industrial Software Company will showcase its latest product portfolio on Booth 5812 at AT Expo, Chicago, from 26th to 28th September 2006.

News from Aegis Europe, Sep 12, 2006

Prismatic film perfects LCD images

Illuminex ADF is a high-tech prismatic film for LCDs that can boost screen brightness by up to 5% while hiding moire effects and defects.

News from GE Plastics, Sep 8, 2006

Memory makers boost equipment demand

ASML Holding expects Q3 2006 unit orders to be at about Q2 2006 order intake level.

News from ASML, Sep 7, 2006

Extreme ultraviolet tools are shipped

ASML has shipped two extreme ultraviolet alpha demo tools to customers.

News from ASML, Aug 31, 2006

Silicon carbide materials come in two grades

Morgan Advanced Ceramics offers Performance silicon carbide (SiC) for semiconductor processing equipment manufacturing.

News from Morgan Advanced Ceramics, Aug 30, 2006

Electronic materials centre set to open in 2007

BASF has started construction of a new integrated production plant for process chemicals for the semiconductor industry.

News from BASF, Aug 28, 2006

Lead frames and moulding for electronic packages

Stamping, selective electroplating, joining and injection moulding are key contributors to the integration of lead frames for smart cards and other miniature semiconductor packaging applications.

News from Tyco Electronics UK, Aug 24, 2006

Brochure available

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Techspray coating speeds up board production

Techspray has launched a fast thermal cure conformal coating product with a tack-free time of three minutes.
Krayden offers Dow Corning assembly sealant

Krayden, along with Dow Corning, has introduced Dow Corning HM-2520 assembly sealant with improved green, tensile strength.

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