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Electronics manufacturing materials

(a sub category of Electronics manufacturing, packaging)

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Electronics manufacturing materials

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Latest articles from 'Electronics manufacturing materials'

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Showing 376-400 of 1014 articles

Rework flux works with lead and lead-free solders

Novel flux technology is uniquely optimised to deliver a high performance with both lead-free and conventional tin-lead solders.

News from Almit Technology, Nov 27, 2006

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Fibre tool cleaves and splices in one

The Recordsplice fibre-optic splicing system features an integrated cleaving and installation tool.

News from AMP Netconnect, Nov 24, 2006

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Mackie manages semiconductor packaging materials

Indium Corporation has announced the addition of Andy Mackie as Product Manager for Semiconductor Packaging Materials.

News from Indium Corporation of America, Nov 23, 2006

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Stick-on stencils simplify BGA rework

Accurate, disposable Flextac stencils are available in a complete BGA stencil rework kit from Intertronics.

News from Intertronics, Nov 17, 2006

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Cable processing system cuts waste onboard

Production automation system specialist Contax has supplied luxury motor yacht manufacturer Sunseeker International with a new cable processing system.

News from Contax, Nov 13, 2006

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Potting material claims clear advantage

New from Polymer Systems Technology, Lightspan LSR-9562-30 is an optically clear, injection-mouldable silicone elastomer.

News from Polymer Systems Technology, Nov 13, 2006

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Roeser takes charge

The Amber Chemical Group has announced the appointment of Joachim Roeser as its new Chief Executive and Managing Director of the Amber Chemical Company.

News from ACC Silicones, Nov 10, 2006

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Potting compounds come in smaller volumes

To complement its successful range of silicone encapsulants and potting compounds ACC has introduced new easy-to-use twin-pack sachets.

News from ACC Silicones, Nov 10, 2006

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Card filter has clear advantage

3M Company has announced an innovative new material that enables the design of the first truly transparent, fully ATM-functioning payment cards.

News from 3M Electronic Materials, Nov 8, 2006

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Airduster blows contaminants off the board

Invertible airduster is ideally suited to removing dust and airborne contamination from very delicate and inaccessible areas of electrical and electronic equipment.

News from Electrolube, Nov 6, 2006

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Machine vision ensures solder quality

DEK has stepped up its collaboration with industry-leading vision specialists following the completion of a recent and successful solder paste inspection development project.

News from DEK, Nov 6, 2006

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Promotion for Kaing

Marie Kaing has been promoted to Chief Chemist at HumiSeal Europe.

News from HumiSeal Europe, Nov 3, 2006

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Radical shift in wafer activation

AML's customers can finally activate, align and bond in-situ, in one chamber.

News from Applied Microengineering, Oct 31, 2006

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Project promises advances in conductive plastics

TBA ECP is developing innovative conductive plastic compounds within the Pan-European PolyCond project.

News from TBA Electro Conductive Products, Oct 31, 2006

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Stencils and squeegees bring lead-free success

A combination of proven design features have been brought together to ensure lead-free printing success through the adoption of stencils and squeegees from Tecan.

News from Tecan, Oct 30, 2006

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Distribution deal opens window on EMI shielding

Miller Dial has signed an agreement with Danish company PSC to be the sole US distributor for its range of EMC products and coatings.

News from Miller Dial, Oct 20, 2006

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Thermoplastics, films and composites on show

GE Plastics will showcase some of its innovative materials and technologies for electrical and electronic device components at Electronica 2006.

News from GE Plastics, Oct 19, 2006

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Plastics promise the white colour for goods

The Design Factory is now offering 12 shades of white in gradations ranging from extremely white to slightly tinted.

News from BASF, Oct 19, 2006

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Speciality compound withstands lead-free reflow

When Winchester Electronics began developing a complete line of RoHS-compliant products it found the plastics it had traditionally used could not handle lead-free reflow.

News from GE Plastics, Oct 19, 2006

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Record revenues and profit for ASML

ASML Holding has announced 2006 third quarter results.

News from ASML, Oct 19, 2006

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Adhesives range answers electronics demands

Specialist coatings, adhesives, encapsulants, potting, sealing and masking products are made for microelectronic and optoelectronic manufacture, rework and repair.

News from Intertronics, Oct 19, 2006

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Extreme ultraviolet lithography expands

ASML and its partners in the semiconductor lithography supply chain have provided an update on their progress towards the commercialisation of extreme ultraviolet lithography.

News from ASML, Oct 18, 2006

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Accelonix joins European distribution team

Indium Corp has expanded its sales efforts in France with the addition of its newest distributor, Accelonix Group.

News from Indium Corporation of America, Oct 16, 2006

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Kinner steps up to European role

Europe's leading vendor of conformal coating solutions, HumiSeal Europe, has announced the internal appointment of its former Chief Chemist, Phil Kinner, to European Sales and Technical Manager.

News from HumiSeal Europe, Oct 12, 2006

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Screens enable precision patterns

High-performance metal mask/screen is designed for printing thick film inks and other materials.

News from Photo Stencil, Oct 11, 2006

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Showing 376-400 of 1014 articles

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