Electronics manufacturing materials
(a sub category of Electronics manufacturing, packaging)
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Electronics manufacturing materials
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Indium offers halogen-free Pb-free solder paste
Indium has released the Indium8.9HF Solder Paste, a halogen-free and Pb-free solder paste with good print-transfer efficiency and response-to-pause printing.
News from Indium Corporation of America, Feb 17, 2009
AMS compact chokes deliver 99% efficiency
The AMS Harmony choke range from MMG Magdev delivers a high-performance power factor correction (PFC) solution to EN61000-3-2.
News from MMG MagDev, Feb 12, 2009
Sn100Sb replaces Sn100 alloys in soldering
BLT Circuit Services has released the Sn100Sb alloy, a lead-free solder alternative.
News from BLT Circuit Services, Feb 11, 2009
Alpha develops lead-free cored solder wire
Alpha, a division of Cookson Electronics, has launched Telecore XL-806, a lead-free cored solder wire.
News from Cookson Electronics, Feb 9, 2009
Bisco guide advises on silicone materials
Rogers has published a 16-page material selection guide for its Bisco silicone materials.
News from Rogers Corp, Feb 9, 2009
Techspray coating speeds up board production
Techspray has launched a fast thermal cure conformal coating product with a tack-free time of three minutes.
News from MR Technical Services, Feb 2, 2009
Krayden offers Dow Corning assembly sealant
Krayden, along with Dow Corning, has introduced Dow Corning HM-2520 assembly sealant with improved green, tensile strength.
News from Krayden, Jan 29, 2009
Fine Line introduces electroformed stencils
Fine Line Stencil has announced Electrolaser electroformed laser cut stencils.
News from Fine Line Stencil (division of FCT Assembly), Jan 26, 2009
Fine Line releases squeegee blades
Fine Line Stencil has announced its Slic Blade line of squeegee blades.
News from Fine Line Stencil (division of FCT Assembly), Jan 26, 2009
Fine Line invests in LPKF laser technology
Fine Line Stencil has announced the availability of LPKF Laser Technology/SMT Stencil Laser Technology.
News from Fine Line Stencil (division of FCT Assembly), Jan 26, 2009
Intertronics offers Dymax soft gasket material
Intertronics has introduced a tack-free, soft gasket material from sales partner, Dymax, for sealing fuel cells, appliance housings, and critical electronic assemblies and devices.
News from Intertronics, Jan 26, 2009
Thermoset MA-511 seals microelectronics
Lord has brought out Thermoset MA-511, a new epoxy adhesive/sealant.
News from Lord Corporation, Jan 26, 2009
Bliss announces Flexconveyor launch
Bliss Industries has announced plans to launch its Flexconveyor on 4 February 2009.
News from Bliss Industries, Jan 23, 2009
Slic material reduces stencil cleaning
Fine Line Stencil, a division of FCT Assembly, has announced that its Slic stencil material offers proven performance gains.
News from Fine Line Stencil (division of FCT Assembly), Jan 23, 2009
Rogers expands Poron material range
Rogers Corporation has unveiled the Dura-Shape option of its Poron urethanes.
News from Rogers Corp, Jan 21, 2009
Ultraslic FG solder paste stencil launched
Fine Line Stencil has announced the launch of the Ultraslic FG solder paste stencil.
News from Fine Line Stencil (division of FCT Assembly), Jan 19, 2009
Rogers to unveil RT/duroid materials and laminates
Rogers is to exhibit its RT/duroid high-frequency materials and RO3000 and RO4000 laminates at the IEEE Radio and Wireless Symposium in San Diego during Radio and Wireless Week, 19-20 January.
News from Rogers Corp, Jan 7, 2009
Oxford's gauges measure paint thickness
Oxford Instruments has brought out the handheld CMI153 and CMI250 coating thickness gauges for the paint and powder coating industry.
News from Oxford Instruments Industrial Analysis, Jan 6, 2009
Master Bond debuts clear epoxy
Master Bond EP29LP is a multi-purpose two-part optical epoxy featuring essential qualities for large casting and potting applications.
News from Master Bond, Dec 12, 2008
Adtech releases multi-layer ceramic feedthroughs
Adtech Ceramics has introduced custom hermetic feedthroughs that use multi-layer co-fire technology, for microwave, spectrometry, high power and high frequency applications up to 30GHz.
News from AdTech Ceramics, Dec 10, 2008
Intertronics offers silicone elastomers
Intertronics has released a range of silicone elastomers from sales partner ACC Silicones, including optically clear encapsulants and a range of gels and rubbers with differing cure cycles.
News from Intertronics, Dec 2, 2008
Conformal coating defends assemblies from moisture
The first-level defence of electronic assemblies is often a post-assembly dielectric spray used to protect against moisture, bio-hazards and low-level mechanical problems.
News from Intertronics, Nov 24, 2008
Fry's and Cookson America join ITAR register
Cookson Electronics has announced that its parent companies, Fry's Metals and Cookson America, have received their official ITAR (International Traffic in Arms Regulations) registration.
News from Cookson Electronics, Nov 20, 2008
Tecan uses PEF and PCM manufacturing processes
Manufacturing facilities at Tecan are used to produce a range of flat metal products such as shims, washers, gaskets and spacers for the most demanding applications.
News from Tecan, Nov 4, 2008
Alpha uploads virtual trade show
Alpha has uploaded a virtual trade show on to its website.
News from Cookson Electronics, Nov 3, 2008
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