Since its introduction in early 2004 by Cookson Electronics Assembly Materials, Alpha Vaculoy SACX lead-free wave solder alloy has set a new benchmark for performance.
News Release from: Cookson Electronics
Edited by the Electronicstalk Editorial Team on 10 November 2005
Since its introduction in early 2004 by Cookson Electronics Assembly Materials, Alpha Vaculoy SACX lead-free wave solder alloy has set a new benchmark for performance. This next generation product cost-effectively delivers high yield, fast throughput and outstanding reliability, while meeting the strict lead-free environmental mandates. 'We have seen many successful conversions from tin-lead alloys to Alpha Vaculoy SACX lead-free wave solder alloy on a global basis, and in particular, in the Asia-Pacific region', said Gerry Campbell, Global Product Manager for Cookson Electronics Assembly Materials.
'SACX provides our customers the quality and reliability they have come to expect from Cookson products, while helping them meet industry lead-free initiatives, and helping them reduce their alloy costs by up to 30% compared with SAC 305'.
The fast wetting speed of Alpha Vaculoy SACX delivers improved solderability, outperforming all Sn/Cu based alloys.
It provides excellent drainage and minimises bridging defects.
Alpha Vaculoy SACX creates strong, mechanically sound joints with excellent long-term reliability.
The solder minimises dross generation, resulting in low process maintenance and reduced product waste.
The Alpha Vaculoy SACX process window supports the use of a wide range of flux technologies.
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