Electronics manufacturing materials
(a sub category of Electronics manufacturing, packaging)
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Electronics manufacturing materials
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Indium supports packaging symposium
Indium Corporation will be exhibiting at the International Microelectronics and Packaging Society (IMAPS) - Garden State Chapter's Spring Packaging Symposium on 11th May 2005.
News from Indium Corporation of America, Apr 28, 2005
Award recognises solar power advances
Advanced Diamond Solutions has won the Ignite Energy Award for developing a clean energy product using amorphous diamond, under the brand Advanced Diamond Energy.
News from Advanced Diamond Solutions, Apr 28, 2005
PCB material allows denser routing
Rogers Corp is introducing new, thinner RO4350B high frequency circuit materials for high speed digital and test applications.
News from Rogers Corp, Apr 27, 2005
Conductive adhesive handles Pb-free processing
Henkel has introduced a new conductive adhesive to address the requirements of higher temperature processes such as lead-free manufacturing.
News from Henkel, Apr 26, 2005
Lead-free advice in Boston
Indium Corporation will be exhibiting at Nepcon East/Electro at the Boston Convention Center on 4th and 5th May 2005.
News from Indium Corporation of America, Apr 25, 2005
Liquid fluxes address specific product demands
The electronics group of Henkel has introduced several new liquid flux materials to suit varying manufacturing requirements.
News from Henkel, Apr 25, 2005
Insider role for Nash
Indium Corporation has recruited Christopher Nash as an Account Specialist for Inside Sales at its Global Headquarters in Clinton, New York.
News from Indium Corporation of America, Apr 21, 2005
Catalogue brings latest additions together
Kaisertech has just produced a 16-page product additions catalogue as a supplement to its existing 160-page publication.
News from Kaisertech, Apr 21, 2005
Indium expands in China
Indium Corporation has added two new employees in its Suzhou, China manufacturing and service centre.
News from Indium Corporation of America, Apr 18, 2005
Elastomers incorporate ferrous filled polymer
Cho-Mute can be used to eliminate EMI and EMC problems in a variety of applications such as transmitters, receivers, microcontrollers and microprocessors.
News from Chomerics Europe, Apr 15, 2005
Charge dissipating agent boosts e-beam accuracy
Espacer 300F is a new grade of charge dissipating agent claimed to substantially enhance the efficiency of electron-beam lithography processes in the production of integrated circuits.
News from SDK, Apr 14, 2005
Semiconductor packaging expertise in Singapore
Indium Corporation will feature advanced assembly materials for semiconductor packaging at Semicon Singapore.
News from Indium Corporation of America, Apr 14, 2005
Pb-free showing in Atlanta and Minneapolis
Indium Corp will be exhibiting its wares at SMTA shows this month in Atlanta, Georgia, and Minneapolis, Minnesota.
News from Indium Corporation of America, Apr 12, 2005
Lead-free solder materials and chemicals on show
Almit Technology will show its extensive range of advanced lead-free solder materials and chemicals at SMT Nurnberg 2005.
News from Almit Technology, Apr 8, 2005
Brighton debut for high-speed device programmer
Adaptsys will be introducing a number of advanced component programming, marking and handling solutions at Nepcon UK 2005 (Stand U401).
News from Adaptsys, Apr 8, 2005
Programme sticks range together
A novel solution designed to make life easier for both designers and production specialists will be launched at the upcoming Nepcon Electronics Exhibition in Brighton.
News from Intertronics, Apr 4, 2005
Lead-free PCB assembly in Nuremberg
Indium Corporation will exhibit advanced technology Pb-free PCB assembly materials at SMT/Hybrid/Packaging 2005 in Nuremberg.
News from Indium Corporation of America, Apr 1, 2005
Anweiler moves up to regional role
Indium Corporation has promoted Jeff Anweiler to Northeastern Regional Sales Manager, covering Eastern Canada and the Northeast United States.
News from Indium Corporation of America, Mar 28, 2005
Flip-chip bonding leads the way in Brighton
Accelonix will be unveiling a number of new products at this year's Nepcon in Brighton.
News from Accelonix (UK), Mar 25, 2005
Cabinets keep components fresh for reflow
Almit Technology is using Nepcon 2005 to show models from its newest range of Super Dry humidity control cabinets into the UK market.
News from Almit Technology, Mar 24, 2005
Brighton showing for lead-free materials
Almit Technology will show its extensive range of advanced lead-free solder materials and chemicals at Nepcon 2005.
News from Almit Technology, Mar 24, 2005
Advanced assembly materials on show in Munich
Indium Corp will exhibit at Semicon Europa in Munich, Germany from 12th to 14th April 2005.
News from Indium Corporation of America, Mar 24, 2005
Aerosol products set to clean up onboard
Kaisertech has introduced a new range of Ambersil aerosols plus Servisol soldering products to its consumables range.
News from Kaisertech, Mar 23, 2005
Three move up at Indium
Indium Corp has made three internal promotions.
News from Indium Corporation of America, Mar 21, 2005
Fabric is swift answer to shielding
Swift-Shield is a very flexible conductive fabric that can be used in many applications to protect people and sensitive electronic equipment from interference.
News from Swift Textile Metalizing, Mar 18, 2005
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