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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Hysol QMI600
Edited by the Electronicstalk Editorial Team on 08 July 2005
Die attach paste survives thermal
cycling
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Hysol QMI600 die attach paste provides a low coefficient of thermal expansion and high modulus to match existing mould compound properties.
Hysol QMI600 is the most recent advanced packaging material from Henkel to hit the market A silica-filled, low viscosity, nonconductive die attach paste, Hysol QMI600 provides a low coefficient of thermal expansion (CTE) and high modulus to match existing mould compound properties, which enables wirebonds in same size die stack packages to survive thermal cycling