Click on the advert above to visit the company web site
Product category: Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Hysol QMI168
Edited by the Electronicstalk Editorial Team on 11 July 2005
Conductive adhesive suits leadframe
attachment
Request your FREE weekly copy of the Electronicstalk email newsletter. News about Electronics Manufacturing Materials and Consumables and more every issue. Click here for details.
Hysol QMI168 is a silver filled conductive adhesive designed specifically for attachment of integrated circuits to metallic leadframes.
Henkel's latest semiconductor packaging material, Hysol QMI168, is a silver filled conductive adhesive designed specifically for attachment of integrated circuits (ICs) to metallic leadframes With hydrophobic properties and excellent stability at high temperatures, Hysol QMI168 produces void-free bond lines and excellent interfacial adhesion to a wide variety of metals and ceramic surfaces