News Release from: Microstencil
Edited by the Electronicstalk Editorial Team on 15 August 2005
New facility produces state-of-the-art stencils
MicroStencil has opened a new production facility for the manufacture of ultra-fine-pitch screen printing stencils.
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UK-based MicroStencil has opened a new production facility for the manufacture of ultra-fine-pitch screen printing stencils. Following its spin-out from Edinburgh's Heriot-Watt University, additional investment has now enabled MicroStencil to expand its stencil manufacturing process at its headquarters in Livingston, near Edinburgh, with the installation of a class 100 cleanroom environment and customised production equipment based on the semiconductor manufacturing processes. The company provides a new type of electroformed stencil which allows the fabrication of sub-100um aperture pitch with outstanding quality - a major breakthrough for the microelectronics packaging industry.
The product has the potential to deliver considerable advantages in the field of interconnecting technology and offers particular benefits in screen printing for wafer bumping and chip bonding.
MicroStencil has developed a process which forms high tolerance apertures with extremely smooth sidewalls.
Such stencils are beginning to enable printing at sub-150um pitch, a realm which was traditionally dominated by alternative, more costly and time-consuming techniques.
Whereas current methods of applying solder bumps using stencil printing cannot cost-effectively get below a 150um aperture pitch, severely restricting the use of flip-chip packaging, MicroStencil, via the use of innovative fabrication technology, is able to push the limits down to 10um aperture size and 10um web space.
The technology is a quantum leap for achieving high-density electrical interconnects leading to higher portability and functionality in electronic systems with devices such as mini-disk players, digital cameras, personal digital assistants, flat panel displays and mobile phones just a few examples of products which will directly benefit.
The company is currently working with major chip manufacturers, wafer bumping developers, leading contract electronic manufacturers, fine pitch substrate users, emerging technology developers and a number of R and D institutions.
MicroStencil has a team of highly skilled engineers at its disposal and a management team with extensive experience of the semiconductor industry led by Chief Executive Officer Gwyn Pugh, a former General Manager, Manufacturing with Motorola, Scotland and Vice President, Manufacturing and Distribution with General Electric, Spain.
Chief Technical Officer Robert Kay, one of the inventors of the technology, has considerable knowledge and experience in the manufacturing of stencils for screen printing applications.
A member of the International Microelectronics and Packaging Society (IMAPS UK), Kay has completed his PhD work in advanced microsystems assembly and has presented his research work at national and international conferences.
He commented: 'MicroStencil's product is a truly enabling technology'.
'Our enhanced manufacturing process removes the current limitations on stencil printing, offering the industry ultra fine pitch sub-100 micron stencils which provide considerable cost savings and higher yield'.
'The completion of our spinout from Heriot-Watt and the upgrading of our new production facility mean we are now perfectly positioned to begin the process of taking our product to the marketplace'.
In addition to manufacturing, MicroStencil also provides advice, service and training centred on stencil printing to ensure its technology can be integrated seamlessly into client applications.
The company has received Smart-Scotland and Spur awards from the Scottish Executive and in April 2005 attracted significant funding from Braveheart Ventures, Alice Ventures, Alice Lab and the Scottish Co-investment Fund.
MicroStencil has also received assistance from the Scottish Enterprise High Growth Start-Up Unit which plays a key role in the creation of new technology businesses in Scotland.
The unit provides hands-on support to turn embryonic ideas into high growth businesses and is complemented by a range of private sector experts with specific technical, commercial, legal, intellectual property (IP) and corporate finance experience.
Assistance is given for projects across a wide range of key sectors including optoelectronics, biotechnology, software, chemical engineering, oil and gas and microelectronics.
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