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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Hysol FP4548FC
Edited by the Electronicstalk Editorial Team on 01 August 2005
Flip-chip underfill is easy to work with
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A new advanced material specifically designed as an underfill for flip-chip devices provides superior flow and more robust processing capability compared with competing products.
The Electronics Group of Henkel has brought to market its latest high purity, liquid epoxy encapsulant material, Hysol FP4548FC The advanced material has been designed specifically for use as an underfill for flip-chip devices and provides superior flow and more robust processing capability as compared with competing products