Product category: Electronics Manufacturing Materials and Consumables
News Release from: Accelonix (UK) | Subject: Flip chip bonding solutions
Edited by the Electronicstalk Editorial Team on 25 March 2005
Flip-chip bonding leads the way in
Brighton
Accelonix will be unveiling a number of new products at this year's Nepcon in Brighton.
Accelonix will be unveiling a number of new products at this year's Nepcon in Brighton Following its recent appointment by Datacon, visitors to Stand G132 will be able to find out more about the latest flip chip bonding solutions, the 8800 FC Quantum dual-head flip chip bonder, launched last year and capable of bonding 3 units per second
This article was originally published on Electronicstalk on 1 Mar 2002 at 8.00am (UK)
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The 8800 FC Quantum delivers high throughput and accuracy and has been developed for high volume manufacture.
It is ideal for all major flip chip assembly processes, from classic solder bump technology to modern