Product category: Electronics Manufacturing Machinery and Materials
News Release from: Indium Corporation of America
Edited by the Electronicstalk Editorial Team on 28 April 2005
Indium supports packaging symposium
Indium Corporation will be exhibiting at the International Microelectronics and Packaging Society (IMAPS) - Garden State Chapter's Spring Packaging Symposium on 11th May 2005
Indium Corporation will be exhibiting at the International Microelectronics and Packaging Society (IMAPS) - Garden State Chapter's Spring Packaging Symposium on 11th May 2005 at the Bell Laboratories in Murray Hill, New Jersey. Indium Corporation's exhibit will focus on semiconductor, power semiconductor and specialty solder materials, including solder wire, solder preforms, tape and reel preforms, bumping pastes, TAC fluxes and underfills.
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Power semiconductor materials focus of trade show
At the 37th International Symposium on Microelectronics November 16-18, 2004, Indiumıs exhibit will focus on Power Semiconductor Materials, such as Solder Wire, Solder Preforms and Solder Paste
Guckes to develop gallium and germanium
Indium Corporation has hired Terry Guckes as Business Development Director for its Metals and Chemicals Business Unit
In addition, Indium will feature Pb-free solder alloys and solder applications, such as die-attach and SMT mixed technology.
IMAPS is known for the high quality of its technical programmes, which provides delegates with powerful educational and networking opportunities.
Workshops focus on targeted technological themes to provide delegates with state-of-the-art work being done in specific areas.
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