Product category: Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America | Subject: Assembly materials for semiconductor packaging
Edited by the Electronicstalk Editorial Team on 24 March 2005
Advanced assembly materials
on show in Munich
Indium Corp will exhibit at Semicon Europa in Munich, Germany from 12th to 14th April 2005
Indium's exhibit will feature advanced assembly materials for semiconductor packaging and power semiconductor assembly, including no-flow underfills, epoxy fluxes, interconnect fluxes and BGA bumping pastes. In addition, Indium will offer information on a full range of electronic assembly materials, including solder pastes, wave solder fluxes, rework materials, and solder fabrications.
Indium will be exhibiting at Booth 261 on level B2.
Experts will be readily available at the booth to answer questions on semiconductor and Pb-free assembly materials.
Technical papers, articles and other information will also be available.
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