Product category: Electronics Manufacturing Machinery and Materials
News Release from: Almit Technology | Subject: Lead-free solder materials and chemicals
Edited by the Electronicstalk Editorial Team on 24 March 2005
Brighton showing for lead-free materials
Almit Technology will show its extensive range of advanced lead-free solder materials and chemicals at Nepcon 2005.
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Almit Technology will show its extensive range of advanced lead-free solder materials and chemicals at Nepcon 2005. The company's Pb-free solder paste formulations and solder wire have been proven in use for many years in production facilities worldwide. LFM-48 TM HP Pb-free solder paste from Almit is a latest generation tin-copper-silver alloy formulation exhibiting good wetting, easy low-residue printing with long screen and tack life.
It is already approved by, and in use with, major manufacturers around the world, and is suitable for both open blade printing and enclosed print head systems.
Almit will also show the world's best cored solder wire, which is now available in industry standard 96.5%Sn/3%Ag/0.5%Cu Pb-free alloy.
The KR-19SH RMA wire retains all the benefits and advantages of the original product to deliver excellent wetting, high reliability and low residue.
It is available is a range of diameters from 0.3 to 1.6mm on 0.5kg reels - and in selected sizes on Almit's new antistatic handy reels.
Almit is a true technology leader in the field of materials jointing.
The Japanese corporation has been supplying Pb-free solder materials for volume electronics manufacturing production in its home market for over four years, and to the automotive industry for almost a decade.
Addressing these localised lead-free process requirements has put Almit ahead of the curve in the global Pb-free changeover initiative now in progress to meet the 2006 deadline.
Experienced engineering and process staff will be on hand at Almit's Nepcon Stand G626 to advise and guide on lead-free changeover issues.
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