Medical sensor maker receives die bonder

Merit Sensor has received its first Alphasem Easyline 8088 "sensor bonder".

Merit Sensor has received its first Alphasem Easyline 8088 "sensor bonder".

The machine will play a key role in the ramp-up at the new Merit Sensor production site in Utah.

The sensors to be produced at this site are mainly for medical applications such as blood pressure sensors.

The superior process control and high throughput of the Easyline 8088 were decisive selling points, as were the excellent handling of ceramic substrates and the unbeaten die technology.

This purchase proves the confidence Merit Sensor has in the Easyline 8088 for the efficient production of medical pressure sensors.

The equipment is based on the field-proven Easyline platform and features many of the state-of-the-art technologies already known to Alphasem customers such as the high-speed air bearing pick and place system, the closed loop linear motor pick tool that ensures unparalleled bond line thickness control, and the fully automatic wafer handling system.

To meet demands in the field of MEMS and sensors, an active and precise theta control of the bond head has been implemented.

According to Claus Lichtenberg, CEO of Alphasem: "Merit's decision is an additional step towards recognition for Alphasem not only as the technology leader in the die bonding of memory and integrated circuit devices, but also as a leader in the rapidly growing world of medical systems assembly".

Back to top