Product category: Electronics Manufacturing Machinery and Materials
News Release from: Henkel Loctite Adhesives
Edited by the Electronicstalk Editorial Team on 13 June 2006
Materials to make
debut in San Francisco
Innovative materials technologies on show at Semicon West aim to deliver new levels of cost and production efficiencies for modern packaging processes
Packaging firms that visit the Henkel booth at Semicon West 2006 next month in San Francisco, California, will see several innovative materials technologies that are certain to deliver new levels of cost and production efficiencies for modern packaging processes. The first product, Hysol QMI536NB is a revolutionary new die attach material developed for stacked die applications that require extremely low stress and robust mechanical properties.
This article was originally published on Electronicstalk on 13 June 2006 at 8.00am (UK)
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The material is qualified for use in lead-free environments and provides an alternative to film die attach.
Hysol QMI536NB delivers new levels of supply chain efficiency, enabling users to qualify a single material for stacked die packages.
Traditionally, different die attach materials are used for the various layers of a stacked package so as to avoid damage to the die passivation of the first die.
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However, through its unique protective and low-bleed formulation, Hysol QMI536NB can be used for both mother and daughter die, simplifying production processes and lowering costs.
Also being unveiled at the Semicon West event is Henkel's patent-pending accelerated cooling (AC) process for flip-chip manufacturing.
The process is used in conjunction with Henkel's nonconductive paste (NCP) underfill encapsulants, Hysol FP5000 and Hysol FP5001, and enables rapid cooling of the device prior to any excessive heat exposure, thus reducing warpage and voids while improving cycle time by nearly 50% over that of previous thermal compression processes.
This manufacturing improvement comes at a time when packaging companies are migrating away from wire-bonded, face up assemblies toward flip-chip packages to gain footprint and performance efficiencies.
High-performance, compatible material set development is one of the hallmarks of the Henkel product philosophy.
And, there is no better venue than Semicon West to introduce yet another process-optimised material set to the marketplace.
Henkel's Hysol QMI529LS and Hysol GR828A material set is a die attach and mould compound combination designed specifically for thin and ultra-thin surface mount device (SMD) applications.
Both materials are optimised for use in lead-free environments and provide the thin, yet reliable, materials characteristics required for use in today's low-profile consumer electronics products.
To find out more about these latest Henkel materials technologies or any of the company's high-performance products, visit Henkel on Booth 8411 at Semicon West 2006, 11th to 13th July at San Francisco's Moscone Center. Request free introductory details about products from Henkel Loctite Adhesives....
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