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Product category: Electronics Manufacturing Materials and Consumables
News Release from: DEK
Edited by the Electronicstalk Editorial Team on 24 May 2006
Tests show promise of SAC-based solder
pastes
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Research into screen printing for 0201 SMT components using SnPb and SAC solder pastes concludes that SAC pastes have an inherently wider process window.
DEK has concluded research into screen printing for 0201 SMT components using SnPb and SAC solder pastes, highlighting new assembly and board design parameters for robust, high-volume assembly with minimal application-specific modifications Among the observations from analysing a large number of test assemblies post reflow, DEK found that SAC pastes have an inherently wider process window
This article was originally published on Electronicstalk on 28 May 2008 at 8.00am (UK)