Product category: Electronics Manufacturing Machinery and Materials
News Release from: Cookson Electronics | Subject: Bioact SC-10 wipes
Edited by the Electronicstalk Editorial Team on 19 September 2005
Wipes set to
clean up stencil operations
Bioact SC-10 wipes are tough, long lasting lint free cloths, saturated in a mixture of organic solvents designed specially for nonaqueous cleaning operations
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Stencil wipes which disintegrate easily, or which have a poor quality solvent can prove to be less than useful, costly and can actually reduce assembly line throughput. Bioact SC-10, the highly effective nonaqueous cleaning fluid from Cookson Electronics Assembly Materials is now available as the active solvent on Bioact SC-10 presaturated wipes, part of the Alpha cleaning range.
Designed to effectively remove solder paste and uncured adhesives from stencils, squeegees and fittings - even misprinted boards - Bioact SC-10 wipes are also excellent for removing uncured thick film inks and conformal coatings, flux residues, and for general cleaning of fingermarks, general grime and dirt from equipment, pallets etc.
Bioact SC-10 wipes are tough, long lasting lint free cloths, saturated in a mixture of organic solvents designed specially for nonaqueous cleaning operations.
They remove water soluble and rosin based solder pastes, organic contaminants etc, and the solvent then evaporates quickly and cleanly to leave a contaminant free surface.
Stencil mesh and mounting adhesives are unaffected by Bioact SC10 wipes.
The wipes are low odour and the excellent solvency characteristics help reduce process time by encouraging clean stencils.
To minimise solvent evaporation after opening Bioact SC-10 wipes are packed in sealable tubs containing 100 wipes, supplied 12 tubs to a box.
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