Product category: Electronics Manufacturing Materials and Consumables
News Release from: Tecan | Subject: Multilevel stencils
Edited by the Electronicstalk Editorial Team on 3 October 2005
Multilevel stencils minimise post-print rework
Tecan is ramping up production of its multilevel stencils to meet increasing demand from PCB builders
Tecan is ramping up production of its multilevel stencils to meet increasing demand from PCB builders who are increasingly recognising the cost benefits they bring by substantially reducing the need for post-print rework, in both traditional and lead-free production facilities. Key to the success of any solder paste print process is the deposition of exactly the right volume of paste to each and every pad.
This article was originally published on Electronicstalk on 3 October 2005 at 8.00am (UK)
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This is increasingly difficult using traditional stencils as printed circuit boards become more complex and typically contain a wide variety of different size and pitch components - each with their own paste volume and coplanarity requirements.
To minimise rework, it is necessary to ensure that the appropriate paste volumes are deposited for all components, from power and I/O connectors to discretes and fine-pitch devices of all types, in a single squeegee pass.
The Tecan multilevel stencil is critical in delivering exactly the required amount of paste to each pad.
Fundamentally, this is achieved by controlling the thickness of the stencil in selective areas across its surface, local to each component, so that apertures in the thinner areas deliver less paste and apertures in the thicker areas deliver more paste.
In addition to delivering the ideal paste deposit, the technique avoids the problems associated with traditional attempts to selectively increase paste deposits by increasing the size of apertures in the x or y axes, which can result in pad proximity problems such as short circuits.
Increasingly, PCB manufacturers are realising the significant cost savings that can be made by minimising post-print rework - through optimising the print process itself - by employing the proven multilevel stencil.
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