Product category: Electronics Manufacturing Machinery and Materials
News Release from: Cookson Electronics | Subject: Lead-free material solutions
Edited by the Electronicstalk Editorial Team on 15 September 2005
Lead-free range aims
for wider process window
Cookson Electronics has focused on developing products with a greater process tolerance than previous generations of lead-free solder paste, wave solder flux, cored wire and wave solder bar
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New group integrates extensive knowledge base
Cookson Electronics Assembly Materials has set up its Global Applications Technology and Engineering group, which joins its global R and D group
With a 2006 deadline looming, you should be seriously looking at the transition to lead-free soldering - and as materials development moves towards the goal of a wider process window it will help with implementation of the more demanding process. Although it has not been possible to find a drop-in solution in terms of processing temperature, Cookson Electronics has focused its research on developing products with a greater process tolerance than previous generations of lead-free solder paste, wave solder flux, cored wire and wave solder bar.
This will make future electronics assembly more flexible than many manufacturers had envisaged, based on experience of only a few years ago.
The Alpha OM-300 range of solder pastes gives the high performance similar to leaded no-clean pastes to provide a high yielding, high throughput process, with development emphasis at all stages of the production line.
For wave solder flux the Alpha EF-series provides a true environmentally friendly solution, with lead-free compatibility and ultralow VOC emissions.
Further reading
IPC certifies 23 Cookson electronics engineers
Cookson Electronics Assembly Materials global team of 23 applications engineers were trained and certified as IPC Specialists in May
Paste keeps pins clean for testing
Lead-free no-clean solder paste promises unparalleled pin testability, while allowing high print speeds and delivering excellent throughput and yield
These revolutionary fluxes have been developed for even the most stringent reliability requirements, by incorporating rosin into the water-based system.
Wave solder bar development has been continued to provide high fluidity, low drossing performance - both of greater importance for the lead-free process.
Alpha Fluitin 1532 SAC alloy cored solder wire provides fast wetting with high residue reliability properties.
This range provides Cookson with a full line of lead-free material solutions to allow a minimal impact transition to lead-free compliance.
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