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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Henkel Loctite Adhesives | Subject: Multicore MP218
Edited by the Electronicstalk Editorial Team on 09 September 2005
Solder paste eases process transition
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Halide-free no-clean Multicore MP218 solder paste is now optimised to enable modern Sn-Pb processes, allowing for the inevitable interaction with lead-free device finishes.
The Electronics Group of Henkel has announced that the halide-free no-clean Multicore MP218 solder paste is now optimised to enable modern Sn-Pb processes, allowing for the inevitable interaction with lead-free device finishes Multicore MP218 is composed of similar raw materials, activators and other components as those used in next generation lead-free solder pastes
This article was originally published on Electronicstalk on 20 Oct 2004 at 8.00am (UK)