Product category: Electronics Manufacturing Machinery and Materials
News Release from: Rogers Corp | Subject: RO4450B-dx
Edited by the Electronicstalk Editorial Team on 22 March 2006
HF circuit material
suits high density designs
Rogers Corporation will launch a high fill/flow version of the industry standard RO4450B Series high frequency circuit material at this year's Del Mar Electronics Show
RO4450B Series circuit material is a glass-reinforced hydrocarbon/ceramic thermoset bondply designed for performance-sensitive, multilayer printed circuit boards. These bondplys are designed to offer superior high frequency performance and low cost circuit fabrication. The result is a low loss material, which can be fabricated using standard epoxy/glass (FR4) processes.
This article was originally published on Electronicstalk on 22 March 2006 at 8.00am (UK)
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The new RO4450B-dx is a high fill/flow version of the RO4450B bondply.
It is designed to fill those high-density designs while still offering thin dielectric spacing.
RO4403, RO4450B and RO4450B-dx prepregs are based on the RO4000 series core materials and are compatible in multilayer constructions with either RO4003C or RO4350B laminates.
As with RO4000 laminates, RO440 prepregs are compatible with the majority of standard FR4 processing practices.
Rogers will also be featuring its adhesiveless materials for thin multilayer and rigid-flex circuits at the show.
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