Product category: Electronics Manufacturing Machinery and Materials
News Release from: Almit Technology
Edited by the Electronicstalk Editorial Team on 30 March 2006
Lead-free paste set
for launch at Nepcon
Almit Technology will extend its range of process-optimised solders by announcing a new lead-free paste at Nepcon UK this May
Almit Technology will extend its range of process-optimised solders by announcing a new lead-free paste at Nepcon UK this May, created specifically for printing at up to four-times the normal printer excursion speed. Almit's new LFM-48 TM HP (S) solder paste enables increased productivity, allowing European assemblers to bid successfully against competitors in low labour cost countries.
This article was originally published on Electronicstalk on 30 March 2006 at 8.00am (UK)
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Leading-edge solder technologies at Nepcon
Almit Technology will showcase a range of leading-edge solder technologies at this year's Nepcon exhibition, being held at the Birmingham NEC from 15th to 17th May
Solder comes in handy-sized bars
Mini solder bars are an ideal size for use in small dipping pots and solder fountains
Almit will also display LFM-48 TM HP, a new generation lead-free solder paste exhibiting good wetting, high definition printing with long screen and tack life.
It is already approved and adopted by major manufacturers world-wide, for open blade printing and enclosed print head systems.
For through-hole assembly and rework, Almit has also introduced high quality cored solder wire featuring the industry standard 96.5%Sn-3%Ag-0.5%Cu lead-free alloy.
The KR-19SH RMA wire retains all the benefits and advantages of the original product to deliver excellent wetting, high reliability and low residue.
It is available is a range of diameters from 0.3 to 1.6mm on 0.5kg reels - and in selected sizes on Almit's new antistatic handy reels.
Almit is asserting technology leadership throughout the field of materials jointing, with its range of soldering products offering highly optimised characteristics, including low wear on soldering tips, high print speed, and low melting point lead-free technologies.
The Japanese corporation has been supplying lead-free solder materials for volume electronics manufacturing production in its home market for over several years, and to the automotive industry for almost a decade.
Addressing these localised lead-free process requirements has put Almit ahead of the curve in the global lead-free changeover initiative now in progress to meet the European July 2006 deadline.
Experienced engineering and process staff from Almit will be at the booth to advise and guide on all aspects of changing to lead-free changeover.
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