Die bonder to enable microphone expansion

Alphasem's semiconductor technology has been evaluated by Knowles for its leading edge manufacturing process of semiconductor microphones.

Alphasem's semiconductor technology has been evaluated by Knowles for its leading edge manufacturing process of semiconductor microphones.

Over the past months, Knowles Acoustics has registered an extreme increase in the demand for its microphones, and nothing appears to be stopping this trend.

In order to increase its output at very short notice, Knowles is acquiring an Easyline 8088 die bonder from Alphasem.

Knowles Acoustics is the global market leader in the production of silicon microphones.

The contract marks the start of a long-term partnership between the two companies.

Decisive for the purchase of this equipment was the fact that a solution had to be found that would meet the stringent requirements.

Knowles developed a process satisfying the needs of the market.

It boosts chip output while slashing production costs.

The silicon microphones from Knowles replace "classical" microphones by silicon-based ones in cellphones.

Knowles Acoustics as the global market leader will use the Alphasem Easyline 8088 for the attachment of the MEMS device (the microphone) and conventional integrated circuits.

Dan Giesecke, Director of Microcircuit Operations at Knowles, says: "Having carefully evaluated several suppliers and their equipment, Alphasem and the Easyline 8088 demonstrated a clear advantage in process control and cost of ownership".

"Thus, we chose Alphasem as our future partner for silicon microphone assembly".

The equipment is based on the field proven Easyline platform and features many of the already known state-of-the-art technologies such as the high-speed air bearing pick-and-place system, the closed-loop linear motor pick tool for unparalleled bond line thickness control, and the fully automatic wafer handling system.

To meet demands related to microelectromechanical systems (MEMS) and sensors, an active and precise theta control of the bond head has been implemented.

According to Claus Lichtenberg, CEO of Alphasem, this decision of Knowles is an additional step towards being recognised not only as the technology leader in die bonding of memory and integrated circuits, but also as a leader in the rapidly growing world of microelectromechanical systems assembly.

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