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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Indium Corporation of America | Subject: NF260 No-Flow Underfill
Edited by the Electronicstalk Editorial Team on 18 April 2006
No-flow underfill stars in Shanghai
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NF260 no-flow underfill has been awarded the 2006 EM Asia Innovation Award at Nepcon Shanghai, China.
Indium Corporation's NF260 no-flow underfill has been awarded the 2006 EM Asia Innovation Award at Nepcon Shanghai, China Sponsored by EM Asia Magazine, the Innovation Award recognises, rewards, and celebrates excellence in the Asian electronics industry