Die bonders gain integrated tape applicator

A new integrated tape applicator meets the stringent process requirements of leading-edge stacked-die package assembly in the high-volume manufacturing environment.

A new integrated tape applicator meets the stringent process requirements of leading-edge stacked-die package assembly while providing superior productivity and flexibility in the high-volume manufacturing environment.

Ultraslim mobile phones, lightweight laptops, MP3 players, to name just a few, drive the growing demand for devices requiring the highest levels of silicon integration.

This trend has posed numerous challenges on the design and manufacture of packages with smallest form factor.

The prevailing approach to high-level silicon integration is based on stacking individual dice within one single package.

Using adhesive tape as die attach adhesive allows die stacking with virtually perfect coplanarity and eliminates the need to fine-tune epoxy bleed-out at the edge of the dice.

There are several die attach technologies that are based on adhesive tapes such as wafer backside lamination (WBL), preprinted substrates (eg used for board on chip packages for memory applications), and processes where an adhesive tape is individually placed onto a previously bonded bottom die.

Due to its wide application range, the individual placement of tapes is becoming more and more popular.

Specifically, tape application allows stacking of dice with identical dimensions, using the adhesive tape as a spacer between the dice to accommodate the wire bonds loops.

To meet the growing demand, Alphasem has introduced a tape applicator module for the Swissline 9022 die bonder series.

Leading device manufacturers and assembly subcontractors worldwide employ Swissline die bonders for advanced packaging solutions.

The superior process control and high productivity of the Alphasem tape applicator clearly distinguishes it from current market rivals.

In a recent benchmark test conducted by a leading Korean chipmaker, the new tape applicator outperformed its competitors.

The general manager responsible for the manufacturing plant at which the evaluation took place, said: "The new Alphasem tape applicator module really exceeded our expectations".

"Its unparalleled performance ideally suits our requirements and helps us to secure our leadership in manufacturing stacked-die devices".

"We would like to thank Alphasem for their great support and co-operation during the evaluation of the new tape applicator".

The new Alphasem tape applicator offers maximum flexibility in the production environment as it allows simple and fast adaptation to varying production needs.

The possible combination of tape applicator module and epoxy dispenser on one die bonder eliminates time-consuming exchange of modules on product changeover.

Comprehensive inspection capabilities guarantee product integrity to the highest possible levels.

The tape applicator is available with factory-built Swissline 9022 die bonders.

Field upgrades, for recently installed Swissline 9022 die bonders, are available on request.

Back to top