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Product category: Electronics Manufacturing Materials and Consumables
News Release from: Master Bond | Subject: EP21TDC-2AN
Edited by the Electronicstalk Editorial Team on 27 December 2006
Thermally conducting resin bonds, coats
and pots
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Master Bond has completed in-use trial testing of EP21TDC-2AN, a highly flexible, two component, thermally conducting epoxy resin compound for high performance bonding, coating and encapsulation.
Master Bond has completed in-use trial testing of EP21TDC-2AN, a highly flexible, two component, thermally conducting epoxy resin compound for high performance bonding, coating and encapsulation The cured compound exhibits a high, 31% elongation, truly exceptional for a thermal conductive epoxy where the conductivity is a robust 2.6W/m-K