Product category: Electronics Manufacturing Machinery and Materials
News Release from: JE Debens | Subject: Fenix 100
Edited by the Electronicstalk Editorial Team on 8 March 2007
Lead-free alloy saves on silver
Modified tin copper alloy offers outstanding performance without any silver content, making it an economical alternative to lead-free solders containing 3-4% silver
Most lead free solders for attachment or onboard solderability preservation contain silver. For every 1% of silver used in these alloys the material cost of the solder increases by 47%. As silver prices soar, so the cost of these solders will continue to increase. A new modified tin copper alloy, Fenix 100 available from JE Debens, is reported to offer outstanding performance without any silver content, making it an extremely economical alternative to the widely used SAC 305/SAC 405 tin/silver/copper alloys that contain 3-4% silver.
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The obvious answer to reducing the cost is to remove the silver content but previous attempts have resulted in solders with higher melting points that could potentially cause damage to both boards finish and components.
Fenix 100 has a modified structure that makes the melted alloy more fluid so that it solders at lower temperatures.
The recommended wave soldering temperature of 260C is the same as that recommended for SAC 305 alloys.
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Fenix 100's modification treatment also inhibits the copper dissolution suffered by many other lead-free alloys, a copper affinity of tin that not only reduces pot life but also damages fine copper tracks and wires in the circuitry.
The surface appearance of most lead-free solders whether in a solder joint or a solder levelled pad is duller than that achieved previously with tin-lead alloys.
The modification treatment undergone by Fenix 100 produces shinier joints and pads and significantly less surface cracking than many other lead-free alloys.
It is also said that using Fenix 100 reduces the levels of corrosive attack on the steels used for solder pots, pumps and wave formers, making expensive upgrading of wave solder and solder levelling machines unnecessary.
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